ATS-18B-97-C1-R0
AI

The **ATS-18B-97-C1-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heatsink**. It is designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs.
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### 1. Technical Specifications
Below are the primary physical and thermal characteristics of this part:
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) |
| **Material** | Aluminum (Blue Anodized) |
| **Dimension (L x W)** | 45.00mm x 45.00mm |
| **Height** | 10.00mm |
| **Fin Type** | Straight Fin |
| **Attachment Method** | Push-Pin (Brass, 2-pin) |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
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### 2. Detailed Part Breakdown
#### A. Thermal Resistance
The efficiency of the heatsink is measured by its thermal resistance ($^\circ\text{C}/W$). Lower values indicate better cooling:
* **At 1.0 m/s (200 LFM):** ~2.00 $^\circ\text{C}/W$
* **At 3.5 m/s (700 LFM):** ~1.00 $^\circ\text{C}/W$
* *Note: These values improve significantly as airflow (forced convection) increases.*
#### B. Attachment Mechanism (Push-Pin)
This part uses a **spring-loaded push-pin** system.
* **Hardware:** It features brass pins and steel springs.
* **Benefit:** Provides consistent pressure on the component, improving thermal transfer through the TIM.
* **Reliability:** It is more secure than thermal adhesive tapes and allows for easier removal or re-work.
#### C. Thermal Interface Material (TIM)
The "R0" suffix indicates that the part comes with **ATS T766** pre-applied.
* **T766** is a phase-change material designed to fill microscopic air gaps between the component die and the heatsink base, ensuring maximum heat conductivity.
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### 3. Nomenclature Breakdown
To understand variations of this part, use the following coding logic:
| Code Segment | Meaning |
| :--- | :--- |
| **ATS-18** | Series Identifier (Push-Pin Heatsink) |
| **B** | Material (Aluminum) |
| **97** | Specific physical dimensions/fin geometry code |
| **C1** | Blue Anodized finish |
| **R0** | Standard packaging with pre-applied TIM |
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### 4. Ideal Applications
* **Telecom & Networking:** High-speed routers and switches.
* **Embedded Systems:** Industrial PCs and controllers.
* **Power Supplies:** Heat dissipation for MOSFETs and Voltage Regulators.
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What are the PCB hole requirements for mounting the ATS-18B-97-C1-R0?
- ⤷ How does the T766 TIM perform compared to standard thermal grease?
- ⤷ Are there taller height variations of this 45mm x 45mm heatsink?