The **ATS-18B-98-C1-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heatsink** designed for cooling electronic components like CPUs, GPUs, or power transistors. Produced by *Advanced Thermal Solutions (ATS)*, this part belongs to the **maxiFLOW™** series, known for its unique flared fin design that maximizes airflow. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Thermal Resistance** | 1.51°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 15.00mm | | **Fin Configuration** | Flared (Spread) Fins | | **TIM (Thermal Interface Material)** | Pre-applied T766 Phase Change Material | --- ### 2. Key Features * **pushPIN™ Attachment:** This allows for a secure, high-pressure fit to the PCB. It uses a brass pin and a stainless steel spring to ensure the heatsink remains in contact with the heat source during vibration or shipping. * **maxiFLOW™ Geometry:** The fins are not straight; they flare outward. This design increases the surface area and reduces "pressure drop," allowing more air to pass through the fins from the cooling fan. * **Pre-Applied TIM:** The base comes with a high-performance thermal interface material (T766), which eliminates the need for manual thermal paste application and ensures uniform heat transfer. --- ### 3. Electronic Application This part is typically used in the following electronic environments: 1. **Telecommunications:** Cooling high-speed data processors. 2. **Power Supplies:** Dissipating heat from MOSFETs or IGBTs. 3. **Embedded Systems:** Protecting industrial motherboards from thermal throttling. 4. **Automotive:** Managing heat in ADAS (Advanced Driver Assistance Systems) modules. --- ### 4. Thermal Performance Comparison The effectiveness of this heatsink depends on the Air Velocity (Measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 1.51 | | 400 (2.0 m/s) | 0.90 | | 600 (3.0 m/s) | 0.72 |