The **ATS-18B-99-C1-R0** is a specific part number for a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). This component is part of their *push-pin* series, designed for cooling electronic components like CPUs, GPUs, or high-power ASICs. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Anodized Blue) | | **Dimensions** | 45mm x 45mm x 20mm | | **Attachment Method** | Push-Pin (Plastic) with Spring | | **Fin Type** | Straight Fin | | **Thermal Resistance** | ~1.15 °C/W (at 200 LFM) | | **Hole Pattern** | 38mm distance between holes | --- ### 2. Physical Design and Construction * **Heat Sink Geometry:** It features a **Straight Fin** design. This is optimized for airflow that moves in one direction (unidirectional), making it ideal for systems with standard chassis fans. * **Material:** Made from extruded aluminum, which provides a balance between weight, cost, and thermal conductivity. * **Surface Treatment:** The "C1" in the part number indicates a **Blue Anodized** finish. This protects the aluminum from corrosion and slightly improves thermal emissivity. --- ### 3. Attachment Mechanism (Push-Pin) The **Push-Pin** system is the defining electronic assembly feature of this part: * **The Pins:** Plastic push-pins are inserted through pre-drilled holes in the PCB. * **The Springs:** A compression spring provides a precise amount of "downward force," ensuring consistent contact between the heat sink and the chip. * **The Interface:** It usually comes with a pre-applied **Thermal Interface Material (TIM)** or is designed to work with high-performance thermal grease to bridge the microscopic air gaps between the component and the metal. --- ### 4. Thermal Performance Summary Thermal resistance varies based on the airflow (Linear Feet per Minute - LFM). As airflow increases, the heat sink becomes more efficient at removing heat. | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | **200** | 1.0 | 1.15 | | **400** | 2.0 | 0.85 | | **600** | 3.0 | 0.70 | --- ### 5. Application Use Cases * **Networking Equipment:** Switches and routers where internal airflow is consistent. * **Industrial PCs:** Cooling logic chips on embedded motherboards. * **Power Supplies:** Heat dissipation for MOSFETs or voltage regulators.