The **ATS-18B-99-C2-R0** is a high-performance electronic thermal management component. Specifically, it is a **heat sink** manufactured by Advanced Thermal Solutions (ATS) as part of their "pushPIN™" series. --- ### 1. Technical Specifications The following table highlights the core technical data for this specific part number: | Feature | Specification | | :--- | :--- | | **Product Type** | Heat Sink (Passive Cooling) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Mounting Type** | pushPIN™ (Spring-loaded) | | **Fin Type** | Cross-Cut (Square-pin) | | **Dimensions (L x W)** | 45mm x 45mm | | **Height** | 20mm | | **Thermal Resistance** | 11.51 °C/W (at 100 LFM) | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by ATS to identify the characteristics of the component: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **18B**: Series identifier (referring to the attachment style/pin configuration). * **99**: Specific footprint/design code (45mm x 45mm). * **C2**: Thermal Interface Material (TIM) and color code (T766 phase-change material / Blue). * **R0**: Revision or packaging status. --- ### 3. Key Electronic Functions While the heat sink itself does not conduct electricity, it is vital for the operation of electronic components (CPUs, GPUs, FPGAs, or MOSFETs): * **Heat Dissipation:** It increases the surface area of the electronic component, allowing heat to transfer more efficiently from the silicon die to the surrounding air. * **Thermal Interface Material (TIM):** The "C2" designation indicates it comes pre-applied with T766 TIM. This fills microscopic air gaps between the chip and the heat sink to ensure maximum heat transfer. * **PushPIN Attachment:** The use of a spring-loaded pushPIN mechanism ensures a specific amount of "clamping force." This is critical for electronics because too much pressure can crack a PCB, while too little pressure results in poor cooling. * **Airflow Optimization:** The cross-cut fin design is optimized for environments where airflow direction might vary, making it more versatile than traditional straight-fin heat sinks. --- ### 4. Typical Applications * **Embedded Systems:** Industrial PCs and controllers. * **Telecommunications:** High-speed routers and switches. * **Power Electronics:** Power supplies and converters requiring compact cooling.