ATS-18D-07-C2-R0
AI

The **ATS-18D-07-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors.
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### 1. Technical Specifications
The part number follows a specific nomenclature that defines its physical and thermal characteristics:
| Property | Value / Description |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | pushPIN™ |
| **Material** | Aluminum (AL6063) |
| **Attachment Method** | Push-Pin (Plastic or Brass) |
| **Fin Style** | Straight Fin |
| **Thermal Resistance** | 17.00°C/W (at 100 LFM) |
| **Finish** | Blue Anodized |
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### 2. Physical Dimensions
The dimensions are critical for ensuring the part fits onto a Printed Circuit Board (PCB) without interfering with other components.
| Dimension | Measurement (mm) |
| :--- | :--- |
| **Length (A)** | 45.00 mm |
| **Width (B)** | 45.00 mm |
| **Height (C)** | 12.70 mm |
| **Pitch (E)** | 38.00 mm |
| **Pitch (F)** | 38.00 mm |
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### 3. Key Components & Features
#### A. The Fin Profile
This model uses a **Straight Fin** design. This is ideal for systems with a consistent direction of airflow (undirectional air). The spacing between fins is optimized to minimize pressure drop while maximizing surface area for heat exchange.
#### B. The Push-Pin Mechanism
Unlike adhesive-based heat sinks, the "Push-Pin" system uses:
* **Compression Springs:** Provides consistent pressure on the component (TIM) for better thermal conductivity.
* **Plastic/Brass Pins:** Secure the heat sink to pre-drilled holes in the PCB, preventing the heat sink from shifting during vibration or shipping.
#### C. Thermal Interface Material (TIM)
The "R0" at the end of the part number typically indicates that the unit comes pre-applied with **ATS-PPS-07** (or similar) thermal grease or a phase-change material. This eliminates the need for manual application during assembly.
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### 4. Thermal Performance Data
Performance varies based on the Airflow (LFM - Linear Feet per Minute):
| Airflow Velocity | 100 LFM | 300 LFM | 500 LFM | 700 LFM |
| :--- | :--- | :--- | :--- | :--- |
| **Resistance (°C/W)** | 17.00 | 5.30 | 3.20 | 2.40 |
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- ⤷
What are the advantages of Push-Pin mounting over thermal adhesive?
- ⤷ How do I calculate if this heat sink is sufficient for a 10W chip?
- ⤷ Does this model support bidirectional airflow?