The part number **ATS-18F-75-C3-R0** refers to a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "maxiFLOW™" series, specifically designed for cooling electronic components like CPUs, GPUs, and ASICs where space is limited but thermal demands are high. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Anodized Blue) | | **Dimensions (L x W x H)** | 25.0mm x 25.0mm x 20.0mm | | **Fin Style** | Straight (maxiFLOW™ Tapered Fin) | | **Attachment Method** | pushPIN™ (Brass/Plastic pins) | | **Spring Type** | Stainless Steel | | **Thermal Resistance** | ~5.35°C/W (at 200 LFM) | | **Thermal Interface Material** | T412 (Pre-applied) | --- ### 2. Design Components The assembly consists of four main electronic packaging components: * **The Heat Sink Body:** Features a flared-fin design that increases surface area and improves airflow intake while reducing pressure drop. * **pushPIN™ Attachment:** A mechanical fastening system that ensures uniform pressure across the component for optimal heat transfer. * **Compression Springs:** These provide the "Normal Force" required to keep the heat sink in contact with the chip, preventing air gaps. * **TIM (Thermal Interface Material):** The "T412" coating is a phase-change material that fills microscopic air gaps between the chip die and the aluminum base. --- ### 3. Part Number Decoder Understanding the "R0" and other suffixes helps in sourcing the part: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **18F:** Specific series and fin geometry. * **75:** Dimension/Height code. * **C3:** Material/Finish code (Blue Anodized). * **R0:** Revision code / RoHS Compliance status. --- ### 4. Applications This part is commonly used in the following electronic sectors: 1. **Telecommunications:** Cooling small-form-factor networking chips. 2. **Embedded Systems:** For industrial PCs and controllers. 3. **High-Density Power Supplies:** Dissipating heat from MOSFETs or voltage regulators.