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  • ATS-19B-159-C2-R0

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    The **ATS-19B-159-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The following table details the mechanical and thermal characteristics of this specific part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 45mm x 45mm x 20mm | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Resistance** | 2.09°C/W (at 200 LFM) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Design and Construction The "electronic" functionality of this part is passive, meaning it does not require electricity but is critical for the survival of active electronic circuits. * **Fin Profile:** It uses a **Cross-Cut** (pin fin) design. Unlike straight fins, cross-cut fins allow for multi-directional airflow, making it ideal for systems where the direction of the cooling fan might not be perfectly aligned with the sink. * **Push-Pin Attachment:** The "19B" designation typically refers to the specific attachment mechanism. It uses a spring-loaded push-pin system that provides a consistent pressure (Force) against the electronic chip, ensuring optimal contact with the Thermal Interface Material (TIM). * **Thermal Interface Material (TIM):** The part comes with **T766** pre-applied. This is a high-performance phase-change material that fills microscopic air gaps between the chip and the heat sink base to maximize heat transfer. --- ### 3. Thermal Performance Metrics The effectiveness of the ATS-19B-159-C2-R0 depends on the airflow (measured in Linear Feet per Minute - LFM): | Airflow Velocity | Thermal Resistance (Unducted) | | :--- | :--- | | **200 LFM (1.0 m/s)** | 2.09 °C/W | | **400 LFM (2.0 m/s)** | 1.23 °C/W | | **600 LFM (3.0 m/s)** | 0.98 °C/W | --- ### 4. Part Number Breakdown The nomenclature follows a specific logic: * **ATS:** Advanced Thermal Solutions. * **19B:** Series and attachment style. * **159:** Specific geometry/fin configuration. * **C2:** Material/Color (Blue Anodized Aluminum). * **R0:** RoHS compliance status.
    ✨ Follow-up Questions
    • What are the mounting hole dimensions required for this heat sink?
    • Can this heat sink be used with a custom thermal paste instead of the pre-applied T766?
    • What is the weight of the ATS-19B-159-C2-R0 for vibration sensitivity calculations?