The **ATS-19F-07-C2-R0** is a specific electronic component belonging to the **Thermal Management** category. It is a high-performance heat sink designed by **Advanced Thermal Solutions (ATS)**. --- ## 1. Core Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Product Type** | Heat Sink | | **Series** | pushPIN™ | | **Attachment Type** | Push Pin (Spring-loaded) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | ~17.00°C/W (Unducted Flow @ 100 LFM) | --- ## 2. Technical Design & Dimensions This heat sink is part of the **XC (Extra Coarse)** pitch family, designed for environments where airflow might be limited or requires specific pressure. ### Physical Dimensions * **Size (Length x Width):** 45.00 mm x 45.00 mm * **Height:** 12.70 mm * **Pitch:** Fine/Extra Coarse options available within the series; this specific model is optimized for high-density PCB layouts. ### Mounting Mechanism: pushPIN™ The "R0" at the end of the part number indicates the mounting style. The pushPIN™ system uses a flexible, spring-loaded mechanism that: * Ensures consistent pressure on the thermal interface. * Simplifies installation in a manufacturing environment. * Is available in various lengths to accommodate different PCB thicknesses. --- ## 3. Component Breakdown The assembly consists of three primary electronic packaging elements: 1. **The Heat Sink Body:** Aluminum construction allows for rapid heat dissipation from the component (CPU, GPU, or FPGA) to the surrounding air. 2. **Thermal Interface Material (TIM):** Typically comes pre-applied with a high-performance thermal pad or phase-change material to ensure no air gaps exist between the heat source and the sink. 3. **Spring/Pin Assembly:** Provides the mechanical force required to keep the unit secure during vibration or thermal cycling. --- ## 4. Typical Applications This specific size (45mm) is commonly used to cool the following electronic parts: * **FPGA & ASICs:** Integrated circuits that generate significant heat in small footprints. * **Northbridge/Southbridge:** Older motherboard chipsets. * **Power Modules:** High-efficiency DC-DC converters. ---