Electronic Components Datasheet Search
  New Zealand  ▼
ALLDATASHEET.CO.NZ

X  

  • ATS-21F-75-C2-R0

  • AI
    The **ATS-21F-75-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "maxiFLOW™" series, designed to optimize airflow and cooling for electronic components. --- ### 1. Technical Specifications The part number encodes specific physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W)** | 45mm x 45mm | | **Height (H)** | 25mm | | **Thermal Resistance** | 1.70°C/W (at 200 LFM) | | **Airflow Pattern** | Directional (High Performance) | --- ### 2. Key Design Features * **maxiFLOW™ Geometry:** The heat sink features a tapered fin design that increases the surface area for heat dissipation while reducing the pressure drop, allowing air to move more efficiently through the fins. * **pushPIN™ Attachment:** This model uses a specialized attachment system consisting of a brass pin and a stainless steel spring. This ensures even pressure across the component (like a CPU or FPGA) for optimal thermal contact. * **Thermal Interface Material (TIM):** Typically, these come pre-applied with **T766** (a high-performance thermal phase-change material) or similar, ensuring there are no air gaps between the heat sink and the chip. --- ### 3. Common Applications This specific part is used in environments where heat-sensitive electronic components are densely packed, such as: 1. **Telecommunications:** Network switches and high-speed routers. 2. **Data Centers:** Cooling high-end processors or ASICs. 3. **Industrial Controls:** Power supplies and motor controllers that generate significant localized heat. 4. **Embedded Systems:** High-performance single-board computers. --- ### 4. Comparison Table: Thermal Resistance vs. Airflow The efficiency of the ATS-21F-75-C2-R0 scales with the velocity of the air provided by system fans: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 1.70 | | 300 (1.5 m/s) | 1.35 | | 400 (2.0 m/s) | 1.14 | | 500 (2.5 m/s) | 1.01 |
    ✨ Follow-up Questions
    • ⤷ What is the difference between blue anodized and black anodized heat sinks?
    • ⤷ How do I calculate the required LFM for my specific electronic component?
    • ⤷ What are the PCB hole requirements for the pushPIN™ attachment system?