The **ATS-50400B-C1-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "maxiFLOW™" series, designed specifically for cooling electronic components such as processors, FPGAs, and ASICs in high-airflow environments. --- ### 1. Technical Specifications The following table highlights the primary physical and thermal characteristics of this component: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Material** | Aluminum (Anodized Blue) | | **Attachment Method** | maxiGRIP™ (Frame Clip) | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 7.60mm | | **Thermal Resistance** | 3.50°C/W (at 200 LFM) | | **RoHS Status** | Compliant | --- ### 2. Key Electronic & Design Features #### A. maxiFLOW™ Fin Design The heat sink utilizes a spread-fin architecture. This design increases the surface area significantly compared to standard straight-fin heat sinks, allowing for higher thermal performance in forced-air cooling systems (e.g., inside a server chassis or telecom rack). #### B. maxiGRIP™ Attachment System One of the most critical aspects of this part is how it attaches to the electronic component: * **Plastic Frame Clip:** A specialized clip snaps around the perimeter of the electronic component. * **Steady Pressure:** A stainless steel "M-Clip" applies consistent pressure across the center of the heat sink, ensuring optimal contact with the thermal interface material (TIM). * **Non-Destructive:** It does not require holes in the PCB, preventing potential damage to board traces. #### C. Thermal Interface Material (TIM) The "R0" suffix usually indicates that the unit comes pre-applied with a high-performance thermal pad or phase-change material. This ensures that the microscopic air gaps between the component die and the heat sink are filled to facilitate efficient heat transfer. --- ### 3. Common Applications This specific part is typically found in: * **Networking Hardware:** High-speed routers and switches. * **Embedded Systems:** Industrial PCs where vertical space is limited (low profile 7.6mm height). * **Power Supplies:** Cooling voltage regulators or power MOSFETs. ---