The **ATS-61330D-C1-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions, Inc. (ATS)**. This specific part belongs to the **maxiFLOW™** series, designed for cooling electronic components such as processors, FPGAs, and ASICs where space is limited but thermal demand is high. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. | | **Series** | maxiFLOW™ | | **Dimensions** | 33.00mm x 33.00mm | | **Height** | 9.50mm | | **Material** | Aluminum (Black Anodized) | | **Attachment Method** | pushPIN™ | | **Thermal Resistance** | 5.30°C/W @ 200 LFM | | **Fin Style** | Tapered | --- ### 2. Key Design Features #### A. maxiFLOW™ Fin Geometry The "D" in the part number signifies a specific fin pattern. The fins are tapered to maximize surface area while minimizing pressure drop. This allows for better airflow through the heat sink, even in environments with low-speed fans. #### B. pushPIN™ Attachment Instead of using messy thermal adhesives or fragile clips, this part uses the **pushPIN™** system. * **Mechanism:** A spring-loaded pin that passes through pre-drilled holes in the PCB. * **Benefit:** Ensures consistent pressure (clamping force) against the electronic component, which optimizes heat transfer through the Thermal Interface Material (TIM). #### C. Thermal Interface Material (TIM) This model typically comes with a pre-applied **Thermal Pad** or phase-change material on the base. This fills microscopic air gaps between the heat sink and the chip to ensure maximum thermal conductivity. --- ### 3. Typical Applications This electronic part is used to manage heat in high-density PCB layouts, including: * **Networking Hardware:** High-speed routers and switches. * **Embedded Systems:** Industrial controllers and IoT gateways. * **Telecommunications:** Base stations and data transmission modules. * **Computing:** Secondary chipsets or power management ICs (PMICs). --- ### 4. Thermal Performance Comparison *At various airflow rates (Linear Feet per Minute):* | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 200 | 1.0 | 5.30 | | 400 | 2.0 | 4.20 | | 600 | 3.0 | 3.50 |