The **ATS-P2-07-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) such as CPUs, GPUs, and high-power chipsets. --- ### Technical Specifications The following table outlines the physical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Dimensions (L x W x H)** | 45mm x 45mm x 12.7mm | | **Thermal Resistance** | 16.97°C/W (Unducted Flow @ 100 LFM) | | **Flow Pattern** | Straight Fin | --- ### Key Electronic Components & Features #### 1. The Fin Design (Straight Fin) The "P2" in the part number indicates the fin profile. Straight fins provide a large surface area for heat exchange. This specific model is optimized for systems where there is a consistent airflow directed across the board. #### 2. Attachment Mechanism (pushPIN™) Unlike adhesive-based heat sinks, the **ATS-P2-07-C1-R0** uses a mechanical push-pin system. This is critical for electronics because: * **Constant Pressure:** It ensures a firm, uniform contact between the heat sink and the component. * **Reliability:** It prevents the heat sink from shifting during vibration or thermal expansion. * **Reusability:** The part can be removed for component maintenance without damaging the PCB. #### 3. Thermal Interface Material (TIM) This part usually comes with **T766** pre-applied. The TIM is a phase-change material that fills microscopic air gaps between the heat sink and the electronic chip, significantly lowering the thermal resistance of the interface. --- ### Application in Circuit Design This part is typically used in the following electronic environments: * **High-Speed Networking:** Cooling ASICs in switches and routers. * **Embedded Computing:** Protecting industrial-grade processors from thermal throttling. * **Power Electronics:** Managing heat in DC-DC converters or motor drivers.