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  • ATS-P2-131-C2-R0

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    The **ATS-P2-131-C2-R0** is a specific electronic component used for thermal management. It belongs to the **maxiFLOW™** series of high-performance heat sinks manufactured by **Advanced Thermal Solutions (ATS)**. --- ### 1. Technical Specifications The part number encodes specific physical and material properties. Below is a breakdown of its core specifications: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Thermal Resistance (Flow)** | 3.60°C/W @ 100 LFM | | **Dimensions (L x W)** | 45mm x 45mm | | **Height** | 20mm | | **Fin Pattern** | Straight / Square | --- ### 2. Design and Engineering Features This component is engineered for cooling integrated circuits (ICs) and other PCB-mounted semiconductors. * **maxiFLOW™ Geometry:** The heat sink features a tapered fin design that maximizes the surface area for heat dissipation while minimizing pressure drop. This is ideal for high-velocity airflow environments. * **pushPIN™ Attachment:** Instead of messy thermal adhesives or tapes, this model uses a mechanical fastening system. This ensures consistent pressure (clamping force) between the heat sink and the component, improving thermal interface performance. * **Pre-Applied TIM:** Most "R0" variants come with a high-performance **Thermal Interface Material (TIM)** pre-applied to the base, simplifying the assembly process in manufacturing. --- ### 3. Application Use-Cases The ATS-P2-131-C2-R0 is typically used in the following electronic sectors: 1. **Telecommunications:** Cooling for high-speed routers and switches. 2. **Embedded Systems:** Industrial PCs where space is limited but thermal output is high. 3. **Power Electronics:** Managing heat for power converters or high-end CPUs/FPGAs. --- ### 4. Thermal Performance Comparison The effectiveness of this part varies based on the airflow (measured in Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 3.60 | | 300 (1.5 m/s) | 1.90 | | 500 (2.5 m/s) | 1.45 |
    ✨ Follow-up Questions
    • ⤷ What is the difference between blue anodized and black anodized finishes for heat sinks?
    • ⤷ How do I calculate if the 20mm height will fit in my server chassis?
    • ⤷ Can the pushPIN attachment be reused if the component is moved?