ATS-P2-131-C2-R0
AI

The **ATS-P2-131-C2-R0** is a specific electronic component used for thermal management. It belongs to the **maxiFLOW™** series of high-performance heat sinks manufactured by **Advanced Thermal Solutions (ATS)**.
---
### 1. Technical Specifications
The part number encodes specific physical and material properties. Below is a breakdown of its core specifications:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded pins) |
| **Thermal Resistance (Flow)** | 3.60°C/W @ 100 LFM |
| **Dimensions (L x W)** | 45mm x 45mm |
| **Height** | 20mm |
| **Fin Pattern** | Straight / Square |
---
### 2. Design and Engineering Features
This component is engineered for cooling integrated circuits (ICs) and other PCB-mounted semiconductors.
* **maxiFLOW™ Geometry:** The heat sink features a tapered fin design that maximizes the surface area for heat dissipation while minimizing pressure drop. This is ideal for high-velocity airflow environments.
* **pushPIN™ Attachment:** Instead of messy thermal adhesives or tapes, this model uses a mechanical fastening system. This ensures consistent pressure (clamping force) between the heat sink and the component, improving thermal interface performance.
* **Pre-Applied TIM:** Most "R0" variants come with a high-performance **Thermal Interface Material (TIM)** pre-applied to the base, simplifying the assembly process in manufacturing.
---
### 3. Application Use-Cases
The ATS-P2-131-C2-R0 is typically used in the following electronic sectors:
1. **Telecommunications:** Cooling for high-speed routers and switches.
2. **Embedded Systems:** Industrial PCs where space is limited but thermal output is high.
3. **Power Electronics:** Managing heat for power converters or high-end CPUs/FPGAs.
---
### 4. Thermal Performance Comparison
The effectiveness of this part varies based on the airflow (measured in Linear Feet per Minute - LFM):
| Airflow Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 (0.5 m/s) | 3.60 |
| 300 (1.5 m/s) | 1.90 |
| 500 (2.5 m/s) | 1.45 |
- ⤷
What is the difference between blue anodized and black anodized finishes for heat sinks?
- ⤷ How do I calculate if the 20mm height will fit in my server chassis?
- ⤷ Can the pushPIN attachment be reused if the component is moved?