The **ATS-P2-145-C2-R0** is a specific electronic component belonging to the thermal management category. It is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to define the dimensions, fin style, and thermal interface material. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Series** | pushPIN™ | | **Product Type** | Heat Sink | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-pin (Brass) | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 30.00mm | | **Fin Style** | Straight Fin | | **Thermal Interface Material (TIM)** | T766 (High Performance) | --- ### 2. Physical Design Components This part is designed to dissipate heat from integrated circuits (ICs), such as CPUs, GPUs, or FPGAs, through three main electronic/mechanical elements: #### A. The Heat Sink Body * **Aluminum Construction:** Chosen for its high thermal conductivity and lightweight properties. * **Blue Anodized Finish:** Provides a protective oxide layer that increases surface area at a microscopic level and offers corrosion resistance. #### B. The pushPIN™ Mounting System * **Attachment:** Instead of using adhesive tape, this part uses a mechanical push-pin system with a stainless steel spring. * **Pressure:** The spring provides precise, consistent pressure across the component surface, ensuring optimal contact for heat transfer. #### C. Thermal Interface Material (TIM) * **T766 Coating:** The bottom of the heat sink is pre-applied with T766. This is a "phase-change" or high-performance thermal grease that fills microscopic air gaps between the component and the heat sink. --- ### 3. Thermal Performance (Airflow) The effectiveness of the ATS-P2-145-C2-R0 depends on the velocity of the air moving through the fins. | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 2.90 | | 300 (1.5 m/s) | 1.70 | | 500 (2.5 m/s) | 1.40 | --- ### 4. Key Applications * **Embedded Systems:** Industrial PCs where high-vibration environments require mechanical mounting. * **Telecommunications:** High-speed routers and switches. * **Power Electronics:** Voltage regulators and power modules that generate significant heat in a small footprint.