ATS-P2-36-C3-R0
AI

## Technical Overview of ATS-P2-36-C3-R0
The **ATS-P2-36-C3-R0** is a high-performance **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **pushPIN™** series, designed specifically for thermal management of electronic components like CPUs, GPUs, and other integrated circuits.
---
### 1. Key Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | pushPIN™ |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Plastic/Brass) |
| **Dimensions (L x W x H)** | 36.83mm x 36.83mm x 15mm |
| **Fin Style** | Straight Fin |
| **Thermal Resistance** | 14.90 °C/W (Unducted Flow @ 100 LFM) |
---
### 2. Component Analysis
#### A. Thermal Performance
The heat sink is designed to dissipate heat generated by power-hungry electronic parts. The thermal resistance varies based on airflow:
* **Low Airflow (100 LFM):** ~14.90 °C/W
* **High Airflow (700 LFM):** ~2.32 °C/W
#### B. The pushPIN™ Attachment System
Unlike traditional adhesive-based heat sinks, the `ATS-P2-36-C3-R0` uses a mechanical attachment system:
* **Spring-loaded mechanism:** Provides consistent pressure on the electronic component (TIM - Thermal Interface Material) for optimal heat transfer.
* **Ease of Assembly:** Can be installed and removed without chemicals or scraping adhesives.
#### C. Material and Finish
* **Aluminum 6063:** Chosen for its high thermal conductivity and lightweight properties.
* **Blue Anodized Coating:** Provides corrosion resistance and improves emissivity for better radiant heat loss.
---
### 3. Application Use Cases
This specific part is typically used for cooling:
1. **Field Programmable Gate Arrays (FPGAs)**
2. **Application Specific Integrated Circuits (ASICs)**
3. **High-speed Networking Processors**
4. **Power Converters**
---
### 4. Mounting Hole Pattern
The physical footprint and mounting requirements are critical for PCB layout:
```text
Pin-to-Pin Pitch:
Vertical: 36.83 mm
Horizontal: 36.83 mm
Height: 15.00 mm
```
- ⤷
What is the compatible thermal interface material (TIM) for this heat sink?
- ⤷ How do I calculate the thermal resistance for my specific airflow rate?
- ⤷ What are the alternatives to the push-pin mounting system?