CS321613-R18K
AI

The **CS321613-R18K** is a surface-mount (SMD) multi-layer chip inductor. It is a passive electronic component used primarily for filtering, impedance matching, and energy storage in high-frequency circuits.
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### 1. Part Number Breakdown
Understanding the alphanumeric code helps identify its physical and electrical characteristics:
| Code Segment | Meaning | Description |
| :--- | :--- | :--- |
| **CS** | Series Type | Multi-layer Chip Inductor (Standard) |
| **3216** | Case Size (Metric) | 3.2mm x 1.6mm (Equivalent to **EIA 1206**) |
| **13** | Thickness | Approximately 1.3mm |
| **R18** | Inductance Value | **0.18 µH** (R denotes the decimal point) |
| **K** | Tolerance | **±10%** |
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### 2. Technical Specifications
While exact specs can vary slightly by manufacturer (such as Bourns or Chilisin), the standard parameters for an R18K in a 1206 package are generally as follows:
* **Inductance:** 0.18 µH (180 nH)
* **Tolerance:** ±10%
* **Test Frequency:** Typically 25 MHz
* **Quality Factor (Q):** Usually 25-30 (Minimum)
* **Self-Resonant Frequency (SRF):** ~200 - 300 MHz
* **DC Resistance (DCR):** Low (approx. 0.40 Ω - 0.60 Ω)
* **Rated Current:** Approx. 200mA - 400mA (depending on temperature rise)
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### 3. Key Features
* **Multi-layer Construction:** Unlike wire-wound inductors, these are made by layering conductive paste and ceramic material, resulting in a monolithic, solid structure.
* **Magnetic Shielding:** The closed magnetic circuit minimizes crosstalk and electromagnetic interference (EMI) with surrounding components.
* **High Reliability:** Excellent solderability and heat resistance for reflow soldering.
* **Compact Size:** The 1206 footprint is small enough for modern PCBs while still being manageable for automated pick-and-place machines.
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### 4. Common Applications
Due to its inductance value and frequency response, the CS321613-R18K is typically found in:
1. **RF Circuits:** Used for matching networks in wireless communication devices.
2. **EMI Suppression:** Filtering high-frequency noise in power lines or signal lines.
3. **Signal Decoupling:** Preventing high-frequency signals from entering sensitive areas of a circuit.
4. **Consumer Electronics:** Found in tablets, smartphones, and computer peripherals.
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- ⤷
What is the difference between this multi-layer inductor and a wire-wound inductor?
- ⤷ Can you explain how to calculate the SRF (Self-Resonant Frequency) for this part?
- ⤷ What are the recommended soldering temperature profiles for a 1206 chip inductor?