Electronic Components Datasheet Search
  New Zealand  ▼
ALLDATASHEET.CO.NZ

X  

  • CS321613-R18K

  • AI
    The **CS321613-R18K** is a surface-mount (SMD) multi-layer chip inductor. It is a passive electronic component used primarily for filtering, impedance matching, and energy storage in high-frequency circuits. --- ### 1. Part Number Breakdown Understanding the alphanumeric code helps identify its physical and electrical characteristics: | Code Segment | Meaning | Description | | :--- | :--- | :--- | | **CS** | Series Type | Multi-layer Chip Inductor (Standard) | | **3216** | Case Size (Metric) | 3.2mm x 1.6mm (Equivalent to **EIA 1206**) | | **13** | Thickness | Approximately 1.3mm | | **R18** | Inductance Value | **0.18 µH** (R denotes the decimal point) | | **K** | Tolerance | **±10%** | --- ### 2. Technical Specifications While exact specs can vary slightly by manufacturer (such as Bourns or Chilisin), the standard parameters for an R18K in a 1206 package are generally as follows: * **Inductance:** 0.18 µH (180 nH) * **Tolerance:** ±10% * **Test Frequency:** Typically 25 MHz * **Quality Factor (Q):** Usually 25-30 (Minimum) * **Self-Resonant Frequency (SRF):** ~200 - 300 MHz * **DC Resistance (DCR):** Low (approx. 0.40 Ω - 0.60 Ω) * **Rated Current:** Approx. 200mA - 400mA (depending on temperature rise) --- ### 3. Key Features * **Multi-layer Construction:** Unlike wire-wound inductors, these are made by layering conductive paste and ceramic material, resulting in a monolithic, solid structure. * **Magnetic Shielding:** The closed magnetic circuit minimizes crosstalk and electromagnetic interference (EMI) with surrounding components. * **High Reliability:** Excellent solderability and heat resistance for reflow soldering. * **Compact Size:** The 1206 footprint is small enough for modern PCBs while still being manageable for automated pick-and-place machines. --- ### 4. Common Applications Due to its inductance value and frequency response, the CS321613-R18K is typically found in: 1. **RF Circuits:** Used for matching networks in wireless communication devices. 2. **EMI Suppression:** Filtering high-frequency noise in power lines or signal lines. 3. **Signal Decoupling:** Preventing high-frequency signals from entering sensitive areas of a circuit. 4. **Consumer Electronics:** Found in tablets, smartphones, and computer peripherals. ---
    ✨ Follow-up Questions
    • ⤷ What is the difference between this multi-layer inductor and a wire-wound inductor?
    • ⤷ Can you explain how to calculate the SRF (Self-Resonant Frequency) for this part?
    • ⤷ What are the recommended soldering temperature profiles for a 1206 chip inductor?