DFE252010F-R33M
AI

The **DFE252010F-R33M** is a fixed power inductor manufactured by Murata Electronics. It is part of the DFE252010F series, which is designed for high-density power supply circuits in mobile devices.
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### ## Technical Specifications
| Parameter | Specification |
| :--- | :--- |
| **Inductance** | 0.33 µH |
| **Tolerance** | ±20% (M) |
| **Case Size (Metric)** | 2520 (2.5mm x 2.0mm) |
| **Thickness (Height)** | 1.0 mm (Max) |
| **DC Resistance (RDC)** | 17 mΩ (Typical) |
| **Rated Current (Isat)** | ~5.7 A (Based on inductance change) |
| **Rated Current (Itemp)** | ~4.5 A (Based on temperature rise) |
| **Construction** | Metal Alloy (Magnetic Shielded) |
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### ### Key Features
1. **Metal Alloy Core:** Unlike traditional ferrite inductors, this uses a metal alloy powder. This allows for a higher saturation current and better performance in compact spaces.
2. **Magnetic Shielding:** The construction minimizes electromagnetic interference (EMI), which is critical for sensitive electronics like smartphones and tablets.
3. **Low Profile:** With a maximum height of 1.0mm, it is ideal for ultra-thin portable devices.
4. **Soft Saturation:** The metal alloy core provides "soft" saturation characteristics, meaning the inductance drops gradually rather than abruptly as current increases.
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### ### Part Number Breakdown
The part number can be decoded as follows:
* **DFE**: Series Name (Metal Alloy Inductor)
* **2520**: Dimensions (2.5mm length x 2.0mm width)
* **10**: Height (1.0mm)
* **F**: Internal identification code
* **R33**: Inductance value (R33 = 0.33 microhenries)
* **M**: Tolerance (±20%)
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### ### Typical Applications
This component is primarily used in **DC-DC converter circuits** for:
* Smartphones and Wearables
* Hard Disk Drives (HDD) and SSDs
* Portable medical equipment
* Any application requiring high current in a small PCB footprint.
- ⤷What is the difference between metal alloy and ferrite inductors?
- ⤷ How does the 'Isat' rating affect power supply design?
- ⤷ What are the recommended soldering footprints for the 2520 package?