The **LCMXO2-2000HC-6FTG256I** belongs to the **MachXO2** family from Lattice Semiconductor. It is a bridge between a CPLD (Complex Programmable Logic Device) and an FPGA, often referred to as an "Instant-on, non-volatile PLD." --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Lattice Semiconductor | | **Logic Cells (LUTs)** | 2112 | | **Embedded Block RAM (EBR)** | 74 Kbits | | **User Flash Memory (UFM)** | 64 Kbits | | **Distributed RAM** | 16 Kbits | | **Number of I/Os** | 206 User I/Os | | **Package** | 256-ball FTBGA (Fine-Pitch Thin BGA) | | **Operating Voltage** | 2.375V to 3.465V (Core) | | **Speed Grade** | -6 (Standard High Speed) | | **Operating Temperature** | -40°C to 100°C (Industrial Grade) | --- ### 2. Functional Architecture This device is highly integrated and includes several dedicated hardware blocks that reduce the need for external components: * **Non-Volatile Flash:** Unlike standard FPGAs that require an external SPI Flash to load their configuration on startup, this chip stores its configuration internally. It is "instant-on." * **Hardened IP Blocks:** It contains dedicated circuits for common interfaces: * **I2C & SPI:** Dedicated controllers so you don't waste logic cells. * **Timer/Counters:** Built-in 16-bit counters. * **PLL (Phase Locked Loop):** One PLL for clock frequency synthesis and phase adjustment. * **WISHBONE Bus:** Provides a standard internal bus for connecting the Hardened IP to your custom logic. --- ### 3. Pinout and Physical Characteristics The **FTG256** package is a Fine-pitch Thin Ball Grid Array with 256 pins. * **Footprint:** 17mm x 17mm. * **Pitch:** 1.0mm ball pitch. * **I/O Banks:** The I/Os are grouped into four banks, allowing for different voltage standards (e.g., Bank 1 at 3.3V, Bank 2 at 1.8V) simultaneously. --- ### 4. Typical Applications Because of its low power consumption and high I/O count, it is commonly used for: 1. **System Control:** Power sequencing, reset generation, and glue logic between a CPU and peripherals. 2. **Interface Bridging:** Converting signals between different formats (e.g., I2C to Parallel, LVDS to CMOS). 3. **IO Expansion:** Adding more GPIOs to a microcontroller that has run out of pins. 4. **Sensor Hubs:** Managing data collection from multiple sensors before sending it to a main processor. --- ### 5. Part Number Breakdown ```text LCMXO2 - 2000 - H - C - 6 - FT - G - 256 - I | | | | | | | | | Series LUTs Vcc Type Spd Pkg Lead Pins Temp ``` * **H:** High Performance (Standard Voltage). * **C:** Commercial/Industrial Grade Silicon. * **G:** Green (Lead-free / RoHS compliant). * **I:** Industrial Temperature range.