## Overview of LCMXO2-2000HC-6TG100I The **LCMXO2-2000HC-6TG100I** is a non-volatile, low-power Field Programmable Gate Array (FPGA) belonging to the **MachXO2** family by Lattice Semiconductor. It is designed to bridge the gap between low-density CPLDs (Complex Programmable Logic Devices) and high-performance FPGAs. ### Core Specifications | Feature | Specification | | :--- | :--- | | **Logic Cells (LUTs)** | 2,112 | | **User I/Os** | 79 | | **Package** | 100-pin TQFP (Thin Quad Flat Pack) | | **Operating Voltage** | 2.5V to 3.3V | | **Embedded RAM** | 72 Kbits (EBR) | | **User Flash Memory** | 64 Kbits | | **Speed Grade** | -6 (Standard Speed) | | **Temperature Range** | Industrial (-40°C to 100°C) | --- ### Key Internal Components #### 1. Logic Architecture The device is based on Look-Up Tables (LUTs). Each logic block contains four 4-input LUTs and registers. This provides flexibility for implementing combinatorial logic, counters, and state machines. #### 2. Embedded Function Blocks (EFB) One of the most powerful features of this specific chip is the hardened (built-in) IP blocks. These reduce the need to use logic cells for common tasks: * **I2C Interfaces:** Hardened controllers for peripheral communication. * **SPI Interfaces:** Integrated Serial Peripheral Interface. * **Timer/Counters:** Dedicated 16-bit timers. #### 3. Instant-On Configuration Because it includes **embedded Flash memory**, the FPGA configures itself instantly upon power-up (usually in less than 1ms). This makes it ideal for system control and power-sequencing tasks where the chip must be active before the main processor. #### 4. Power Management The "HC" in the part number indicates a high-performance/standard power variant. However, it still features "FlashBAK" technology, allowing for ultra-low static power consumption during standby modes. --- ### Pin and Package Details The **100-TGFP** package is popular for prototype development and industrial applications because: * **Pitch:** 0.50mm pin pitch allows for relatively easy PCB routing. * **I/O Banks:** The 79 user I/Os are distributed across multiple banks, allowing for different voltage standards (e.g., 1.8V, 2.5V, and 3.3V) to be used simultaneously on different pins. --- ### Part Number Breakdown | Prefix | Family | Density | Voltage | Speed | Package | Pins | Temp | | :--- | :--- | :--- | :--- | :--- | :--- | :--- | :--- | | **LCMXO2** | MachXO2 | **2000** LUTs | **HC** (High) | **-6** | **TG** (TQFP) | **100** | **I** (Ind.) |