The **LCMXO2-256UHC-3TG100ITRES** is a specific integrated circuit part number belonging to the **MachXO2** family of FPGAs (Field Programmable Gate Arrays) produced by Lattice Semiconductor. --- ### 1. Part Number Breakdown Understanding the suffix and prefix codes is essential for identifying technical specifications: | Segment | Code | Meaning | | :--- | :--- | :--- | | **Family** | LCMXO2 | MachXO2 Series (Low power, instant-on FPGA) | | **LUT Count** | 256 | 256 Look-Up Tables (Density of the logic) | | **Voltage** | HC | High Performance / High Voltage (VCC = 2.5V to 3.3V) | | **Speed** | 3 | Speed Grade 3 (Faster performance within the family) | | **Package** | TG100 | TQFP (Thin Quad Flat Pack), 100-pin | | **Temp Range** | I | Industrial Temperature (-40°C to +100°C) | | **Special** | TRES | Specific tracking or Tape & Reel/Special variant | --- ### 2. Core Technical Specifications The MachXO2 series is often referred to as a "bridging" device because it combines the flexibility of an FPGA with the non-volatile characteristics of a CPLD. * **Logic Capacity:** 256 LUTs (Look-Up Tables), suitable for simple control logic, state machines, or I/O expansion. * **Embedded Memory:** Includes User Flash Memory (UFM) and Embedded Block RAM (EBR). * **I/O Count:** Provides up to **78 User I/Os** in the 100-pin TQFP package. * **Instant-on:** The device configures itself from internal flash in microseconds upon power-up. * **Hardened IP:** Includes built-in hard-coded functions for $I^2C$, SPI, and Timer/Counters, which saves logic cells for other tasks. --- ### 3. Key Electronic Features #### A. Internal Flash Configuration Unlike high-end FPGAs that require an external PROM to load code every time they power up, this chip stores its configuration internally. This reduces the PCB footprint and increases security (bitstreams are harder to intercept). #### B. Power Management The "HC" designation indicates a logic core that runs on standard 2.5V or 3.3V supplies. It features low static power consumption, making it ideal for battery-operated or thermally sensitive industrial applications. #### C. Connectivity & Bridging This part is frequently used for: * **Level Shifting:** Moving signals between 1.8V, 2.5V, and 3.3V domains. * **I/O Expansion:** Adding more GPIOs to a microcontroller that has run out of pins. * **Interface Bridging:** Converting signals from $I^2C$ to parallel or custom protocols. --- ### 4. Package Dimensions (TG100) The 100-pin TQFP package is popular because it can be hand-soldered or inspected visually, unlike BGA (Ball Grid Array) packages. | Feature | Specification | | :--- | :--- | | **Body Size** | 14mm x 14mm | | **Pitch** | 0.5mm | | **Lead Finish** | Lead-Free (RoHS Compliant) | ---