The **M2AS1-4233-R2** is a high-performance M.2 (NGFF) connector, typically manufactured by **LOTES**. This component is a critical interface part used on motherboards, industrial PCs, and laptops to connect SSDs, Wi-Fi modules, or LTE cards. ### 1. General Specifications The part number follows a specific nomenclature used by LOTES to define height, keying, and plating. | Feature | Specification | | :--- | :--- | | **Connector Type** | M.2 (Next Generation Form Factor - NGFF) | | **Interface Type** | 0.50mm Pitch, 67-Pin | | **Mounting Type** | Surface Mount (SMT) | | **Orientation** | Right Angle / Horizontal | | **Height** | 4.2mm (Commonly used for double-sided M.2 cards) | | **Keying** | Likely **M-Key** (Common for NVMe/PCIe SSDs) | --- ### 2. Physical Design & Materials Electronic connectors must withstand high heat (during reflow soldering) and provide low-resistance electrical paths. * **Housing:** High-temperature Thermoplastic (LCP - Liquid Crystal Polymer), UL94V-0 rated. * **Contacts:** Copper Alloy (Phosphor Bronze or similar) for high conductivity. * **Plating:** * **Contact Area:** Gold plating (ensures signal integrity and prevents oxidation). * **Solder Tail:** Matte Tin or Gold Flash over Nickel. * **Solder Pegs/Holdowns:** Metal tabs on the sides of the connector to provide mechanical stability and ground connection to the PCB. --- ### 3. Electrical & Mechanical Characteristics These parameters are vital for engineers designing high-speed data circuits. | Parameter | Value | | :--- | :--- | | **Current Rating** | 0.5A per pin | | **Voltage Rating** | 50V AC/DC | | **Insulation Resistance** | 500MΩ Min | | **Contact Resistance** | 55mΩ Max | | **Durability** | 60 Mating Cycles | | **Operating Temp** | -40°C to +85°C | --- ### 4. Application Use Case The **R2** in the suffix often denotes a specific revision or packaging style (Tape & Reel). Because this connector has a **4.2mm height**, it provides enough clearance for: 1. **Double-sided M.2 modules:** Components mounted on both the top and bottom of the SSD/Card. 2. **Airflow:** Better thermal management under the card compared to lower-profile (2.3mm or 3.2mm) connectors. --- ### 5. Pin Layout (Signal Integrity) The connector supports high-speed protocols including: * **PCIe Gen 3 & Gen 4:** Requires precise impedance matching (100Ω differential). * **SATA 3.0:** Backward compatibility for storage. * **USB 3.0/4.0:** Depending on the specific keying assigned to the host controller.