The **M2AS1-4344-R2** is a specialized high-speed connector component, typically categorized as an **M.2 (NGFF) SMT (Surface Mount Technology) Card Edge Connector**. These parts are foundational in modern computing for interfacing SSDs, wireless cards, and cellular modules with motherboards. --- ## 1. Technical Specifications The part number follows a specific nomenclature used by manufacturers (often associated with brands like **Lotes** or **Foxconn**). Below are the typical electronic and mechanical characteristics: | Feature | Specification | | :--- | :--- | | **Interface Type** | M.2 (Next Generation Form Factor) | | **Mounting Type** | Right Angle, Surface Mount (SMT) | | **Number of Positions** | 67-Pin (Standard for M.2) | | **Keying** | Usually "M" Key (for PCIe x4/SATA SSDs) or "B" Key | | **Height** | 4.4mm (Indicated by the "44" in the suffix) | | **Pitch** | 0.50 mm | | **Contact Material** | Copper Alloy with Gold Plating | --- ## 2. Key Components & Construction ### A. Contact Interface The internal pins are designed with a **spring-action mechanism**. This ensures constant pressure against the gold fingers of the M.2 card, maintaining electrical continuity even under vibration. ### B. Signal Integrity Features * **Impedance Control:** Designed to maintain 100 Ohms differential impedance to support PCIe Gen 3 and Gen 4 speeds. * **EMI Shielding:** The metal "ears" or solder tabs on the sides provide mechanical grounding to the PCB, reducing electromagnetic interference. ### C. Material Composition * **Insulator:** High-temperature thermoplastic (LCP - Liquid Crystal Polymer) capable of withstanding Reflow Soldering temperatures (approx. 260°C). * **Plating:** Typically 15u" or 30u" Gold plating on the contact area to prevent oxidation over time. --- ## 3. Application Use Cases The **R2** revision generally indicates a minor design refinement (often related to the solder peg shape or material improvements for better manufacturing yields). * **Storage:** NVMe SSDs in laptops and NUCs. * **Connectivity:** 4G/5G LTE modules in industrial gateways. * **Edge Computing:** AI accelerator modules (like Google Coral or Hailo) using the M.2 form factor. --- ## 4. Soldering Footprint Example When designing a PCB for this part, the landing pattern usually looks like this in code/script representations: ```python # Conceptual PCB Land Pattern Data component_data = { "part_number": "M2AS1-4344-R2", "pad_pitch": 0.5, "total_pins": 67, "mounting_legs": 2, # Mechanical solder tabs "orientation": "90_degree_horizontal" } ```