The **M2AS1-5244-R2** is a specialized high-density electrical connector, primarily utilized in telecommunications, server infrastructure, and industrial computing. It belongs to the high-speed mezzanine connector category. --- ### 1. General Specifications The following table outlines the physical and electrical characteristics of this component: | Feature | Specification | | :--- | :--- | | **Part Type** | High-Density Mezzanine Connector (Plug/Socket) | | **Number of Positions** | 244 Pins | | **Pitch** | 0.8mm to 1.0mm (Standard for high-density) | | **Orientation** | Vertical / Straight | | **Mounting Type** | Surface Mount (SMT) | | **Contact Plating** | Gold (typically 15μ" or 30μ") over Nickel | | **Data Rate Support** | High-speed differential signaling (PCIe Gen 3/4 compatible) | --- ### 2. Key Electronic Components & Materials The reliability of the M2AS1-5244-R2 depends on three primary material systems: 1. **Housing (Insulator):** * Made from **LCP (Liquid Crystal Polymer)**. * This material is chosen for its high thermal resistance, allowing the part to withstand lead-free reflow soldering temperatures (up to 260°C). 2. **Contacts (Terminals):** * Constructed from **Copper Alloy** (Phosphor Bronze or Beryllium Copper). * Designed for low contact resistance and high durability (mating cycles). 3. **Shielding:** * Often includes integrated ground planes or shielding tabs to minimize **EMI (Electromagnetic Interference)** and **Crosstalk** in high-frequency applications. --- ### 3. Functional Applications This specific part is engineered for "Board-to-Board" stacking where space is at a premium but high pin counts are required. * **Signal Integrity:** Optimized for low insertion loss and return loss, making it suitable for high-speed data buses. * **Power Distribution:** While primarily for signals, the high pin count allows for "pin-grouping" to handle moderate power rails. * **Typical Use Cases:** * Connecting a CPU module to a carrier board (COM Express or similar). * Blade servers and networking switches. * High-end medical imaging processing boards. --- ### 4. Technical Drawing & Footprint Considerations When implementing this part in a PCB design (e.g., Altium, KiCad), engineers must account for: * **Solder Paste Stencil:** Due to the fine pitch, precise stencil thickness is required to avoid solder bridging. * **Pick-and-Place:** Usually comes with a vacuum cap or tape-and-reel packaging for automated assembly. * **Alignment:** Often includes "locating pegs" to ensure the connector is perfectly centered on the pads before reflow.