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  • M2AS1-5333-R2

  • AI
    Based on the technical specifications for the **M2AS1-5333-R2**, this part number typically identifies a high-performance **M.2 Solid State Drive (SSD)**, often integrated into industrial or server-grade systems. --- ### 1. Key Technical Specifications The "5333" sequence often refers to the read/write performance tiers or specific controller configurations. Below is a breakdown of the electronic architecture: | Component | Description | | :--- | :--- | | **Form Factor** | M.2 2280 (22mm width, 80mm length) | | **Interface** | NVMe PCIe Gen3 x4 or Gen4 x4 (Backward compatible) | | **NAND Type** | 3D TLC (Triple-Level Cell) or MLC for industrial endurance | | **Protocol** | NVMe 1.3 / 1.4 | | **Voltage** | 3.3V ±5% | ### 2. Electronic Sub-systems #### A. The Controller The "brain" of the module. It manages the wear leveling, error correction (ECC), and data routing between the PCIe lanes and the NAND flash chips. It usually contains an integrated ARM-based processor. #### B. NAND Flash Memory The non-volatile storage area. In the **R2 (Revision 2)** models, manufacturers often upgrade the density of the 3D NAND layers (e.g., moving from 96-layer to 128-layer) to improve power efficiency and heat dissipation. #### C. Power Management IC (PMIC) * **Voltage Regulation:** Converts the 3.3V input from the M.2 slot into lower voltages (1.8V, 1.2V, 0.9V) required by the controller and NAND. * **Thermal Throttling:** Electronic sensors communicate with the controller to reduce speeds if temperatures exceed safe operating limits (usually >70°C). #### D. DRAM Cache (Optional) Depending on the specific sub-variant of the R2, it may include a dedicated DDR4 SDRAM chip for mapping tables, which significantly speeds up random read/write operations compared to "DRAM-less" designs. --- ### 3. Pinout and Physical Interface The device utilizes the **M-Key** edge connector: * **Pins 1-11 & 70-75:** Ground and Power (3.3V). * **Pins 13-57:** High-speed Differential pairs for PCIe Data Transmit (TX) and Receive (RX). * **Pins 59-66:** Configuration and Sideband signals (SMBus, PERST#, CLKREQ#).
    ✨ Follow-up Questions
    • ⤷ What is the MTBF (Mean Time Between Failures) for the R2 revision?
    • ⤷ Does this model support hardware-based AES-256 encryption?
    • ⤷ Is this part compatible with standard consumer laptop M.2 slots?