Based on the part number provided, this component belongs to the **M2AS series**, which typically refers to **M.2 (NGFF) Connector** assemblies used in modern computing for SSDs, Wi-Fi modules, and other expansion cards. Below is a detailed breakdown of the electronic and mechanical characteristics of this specific type of component. --- ## 1. Component Overview The **M2AS1-5343-R2/N** is a Surface Mount Technology (SMT) connector designed to interface a printed circuit board (PCB) with an M.2 module. | Feature | Specification (Typical) | | :--- | :--- | | **Connector Type** | M.2 (Next Generation Form Factor - NGFF) | | **Mounting Style** | Right Angle, SMT (Surface Mount) | | **Number of Positions** | 67-Pin / 75-Pin (Standard M.2) | | **Pitch** | 0.50 mm | | **Height** | 4.3mm (Indicative by "43" in suffix) | | **Keying** | Likely M-Key or B-Key (Specific to slot usage) | --- ## 2. Key Electronic Characteristics ### Electrical Ratings * **Current Rating:** Typically 0.5A per pin. * **Voltage Rating:** 50V AC/DC. * **Contact Resistance:** Max 50mΩ (initial); varies based on signal integrity requirements. * **Insulation Resistance:** Min 500MΩ. * **Dielectric Withstanding Voltage:** 300V AC for 1 minute. ### Signal Integrity Because these connectors support high-speed protocols like **PCIe Gen 3/4/5**, **SATA 3.0**, and **USB 3.1**, the pin geometry is optimized to minimize: * **Crosstalk:** Reducing interference between adjacent high-speed differential pairs. * **Insertion Loss:** Ensuring signal strength is maintained from the motherboard to the module. --- ## 3. Physical & Material Construction ### Material Composition 1. **Housing:** High-temperature Thermoplastic (UL94V-0 rated), usually LCP (Liquid Crystal Polymer) to withstand reflow soldering temperatures. 2. **Contacts:** Copper Alloy for high conductivity. 3. **Plating:** * **Contact Area:** Gold plating (often 1u", 3u", or 15u") to prevent oxidation and ensure reliable mating. * **Solder Tails:** Tin or Gold flash for better solderability. ### Mechanical Features * **Card Insertion:** The "R2" designation often implies a specific revision or a "Right Angle" orientation where the M.2 card sits parallel to the PCB. * **Latch Mechanism:** Designed to hold the module securely before the mounting screw is applied. --- ## 4. Common Applications This part is commonly found in the following hardware: * **Laptops/Ultrabooks:** For NVMe SSD storage or WLAN/Bluetooth cards. * **Industrial PCs:** For compact mSATA or PCIe expansion. * **Edge Computing Devices:** Used for AI accelerators or cellular (4G/5G) modems. ---