The **M2AS1-6142-R** is a specific part number typically associated with high-density interconnect solutions, specifically **M.2 (NGFF) connectors**. These components are widely used in modern electronics to interface SSDs, wireless modules (Wi-Fi/Bluetooth), and LTE/5G cards with motherboards. --- ## Technical Specifications Based on the standard nomenclature for this series, here are the primary electronic and mechanical characteristics: | Feature | Specification | | :--- | :--- | | **Connector Type** | M.2 (Next Generation Form Factor - NGFF) | | **Mounting Type** | Surface Mount (SMT), Right Angle | | **Number of Positions** | 67 Pins | | **Pitch** | 0.50 mm | | **Height** | 4.2 mm (Standard Profile) | | **Keying** | Typically "M Key" (Supports PCIe x4/SATA) | | **Contact Plating** | Gold (Flash or Selective) | | **Termination** | Solder | --- ## Key Electronic Components & Materials ### 1. Contacts (Pins) * **Material:** Usually Phosphor Bronze or Copper Alloy. * **Function:** Conducts high-speed differential signals. * **Plating:** Gold over Nickel. Gold prevents oxidation and ensures low contact resistance over the lifecycle of the device. ### 2. Housing (Insulator) * **Material:** High-Temperature Thermoplastic (LCP - Liquid Crystal Polymer). * **Function:** Provides structural integrity and electrical isolation between the 67 pins. It must withstand the high heat of reflow soldering (up to 260°C). ### 3. Solder Tabs / Pegs * **Material:** Tin-plated copper. * **Function:** Mechanical stability. These are soldered to the PCB to ensure the connector does not lift off the board when the M.2 card is inserted or removed. --- ## Application Use Cases The M2AS1-6142-R is designed for high-bandwidth data transmission. Common applications include: 1. **Storage:** NVMe SSDs (Solid State Drives) requiring PCIe Gen 3 or Gen 4 speeds. 2. **Computing:** Laptop and Desktop motherboards. 3. **Industrial:** Embedded PC systems and IoT gateways. 4. **Networking:** High-speed network interface cards. --- ## Design Considerations * **Signal Integrity:** Due to the 0.5mm pitch, PCB traces must be carefully routed to avoid crosstalk and impedance mismatch, especially for PCIe 4.0/5.0 signals. * **Thermal Management:** The 4.2mm height provides a specific clearance between the card and the PCB, which is critical for airflow and cooling of the controller chips on the SSD.