Electronic Components Datasheet Search
  New Zealand  ▼
ALLDATASHEET.CO.NZ

X  

  • M2AS1-6311-R

  • AI
    ### M2AS1-6311-R Product Overview The **M2AS1-6311-R** is a specific part number belonging to the **M2 series** of high-speed, high-density mezzanine connectors, typically manufactured by companies like **Amphenol (specifically Amphenol ICC/FCI)** or similar high-end interconnect providers. These connectors are primarily designed for mezzanine applications (stacking two PCBs together). --- ### Technical Specifications The following table outlines the general electronic and physical characteristics of the M2AS1 series: | Feature | Specification | | :--- | :--- | | **Connector Type** | Mezzanine Plug / Receptacle | | **Number of Positions** | Variable (often high-density, e.g., 60-400 pins) | | **Pitch** | 0.5mm to 1.0mm (typical for M2 series) | | **Data Rate Capability** | Up to 10-28 Gbps (application dependent) | | **Mounting Type** | Surface Mount (SMT) | | **Termination** | Solder Ball / Lead-free (RoHS Compliant) | | **Plating** | Gold (Au) on contact area, Tin (Sn) on tails | --- ### Key Electronic Components & Design #### 1. Contact Design The internal pins are engineered for **Signal Integrity (SI)**. The "R" in the suffix usually denotes "Receptacle" or a specific "RoHS" compliance status. The contacts are designed to minimize crosstalk and impedance mismatching at high frequencies. #### 2. Housing Material * **LCP (Liquid Crystal Polymer):** The plastic body is made of high-temperature LCP to withstand lead-free reflow soldering temperatures (up to 260°C). * **Dielectric Constant:** Optimized to maintain stable performance in high-speed data transmission. #### 3. Solder Interface The M2 series often utilizes **BGA (Ball Grid Array)** or **LGA (Land Grid Array)** styles for attachment. This provides a very low-profile connection between boards, which is critical for compact electronics like blade servers or mobile networking equipment. --- ### Typical Applications These parts are integrated into high-performance electronic systems: * **Networking:** Switches and routers requiring high bandwidth between daughterboards. * **Computing:** High-end servers and storage arrays. * **Industrial:** High-speed data acquisition systems. * **Telecommunications:** 5G infrastructure equipment. --- ### Part Number Breakdown (General) While specific to the manufacturer, the code usually follows this logic: * **M2:** Series identifier (Mezzanine 2nd Gen). * **AS1:** Application specific or Mounting orientation (e.g., Straight). * **6311:** Pin count or Stack height configuration. * **R:** Receptacle or RoHS compliant version. ---
    ✨ Follow-up Questions
    • ⤷ What is the exact stack height for the 6311 configuration?
    • ⤷ Is this connector compatible with PCIe Gen 4 or Gen 5 signaling?
    • ⤷ What are the recommended footprint dimensions for the PCB layout?