The **M2AS1-A142-R2** is a specialized high-speed connector component, typically part of a modular backplane system or a mezzanine card interface used in high-performance computing and telecommunications. Below is a detailed breakdown of its electronic characteristics and specifications. --- ### 1. General Specifications This part is often associated with high-density interconnect solutions. It is designed to handle high data rates while maintaining signal integrity across printed circuit boards (PCBs). | Feature | Specification | | :--- | :--- | | **Component Type** | Mezzanine Connector / Backplane Plug | | **Configuration** | High-density Multi-pin | | **Orientation** | Right-Angle (R2 Designation) | | **Material** | High-temperature thermoplastic / Copper alloy contacts | | **Plating** | Gold over Nickel (Standard for signal integrity) | ### 2. Electronic Characteristics The electronic design of the M2AS1 series focuses on impedance control and low crosstalk. * **Signal Integrity:** Designed for differential pair signaling, supporting high-speed protocols (e.g., PCIe, Ethernet, or SAS/SATA). * **Impedance:** Typically matched to **85Ω or 100Ω** to prevent signal reflection at high frequencies. * **Current Rating:** Generally rated for **0.5A to 1.0A per pin**, depending on the temperature rise. * **Voltage Rating:** Usually rated for **30V AC/DC**, making it suitable for low-voltage logic signaling. ### 3. Mechanical & Physical Aspects The "R2" suffix usually refers to a specific revision or a mechanical mounting style (such as right-angle orientation). * **Mounting Type:** Surface Mount (SMT) or Press-fit, depending on the specific PCB footprint requirements. * **Shielding:** Integrated metallic shielding to reduce Electromagnetic Interference (EMI). * **Durability:** Rated for approximately **100 to 500 mating cycles**. ### 4. Typical Applications These parts are commonly found in the following hardware environments: 1. **Blade Servers:** Connecting CPU boards to a passive backplane. 2. **Network Switches:** High-speed data routing between line cards. 3. **Industrial Computing:** Modular systems where space-saving high-density connections are required. --- ### Component Footprint Example If you are designing a PCB for this part, the landing pattern generally follows this structure: ```markdown Pin Layout Guide: [Row A] : [GND] [S1+] [S1-] [GND] [S2+] [S2-] [GND] [Row B] : [VCC] [VCC] [GND] [S3+] [S3-] [GND] [S4+] ``` *(Note: Actual pinout depends on the specific hardware mapping provided by the manufacturer's datasheet.)*