The **M2SES-264-R2** is a specialized electronic component, typically classified as a high-density, high-performance **mezzanine connector** or **module interface connector**. These are commonly used in industrial computing, telecommunications, and high-speed data transfer applications (such as COM Express or custom carrier boards). Below is a breakdown of its technical specifications and electronic characteristics. --- ### 1. Key Technical Specifications The "264" in the part number usually refers to the pin count (264 pins), which is standard for high-bandwidth interfaces. | Feature | Specification | | :--- | :--- | | **Pin Count** | 264 Pins | | **Pitch** | Typically 0.5mm or 0.6mm (Fine pitch) | | **Mounting Type** | Surface Mount (SMT) | | **Interface** | Mezzanine (Board-to-Board) | | **Material** | High-temperature thermoplastic with Gold plating | | **Signal Integrity** | Rated for high-speed differential signaling | --- ### 2. Electronic Characteristics To ensure reliable operation in complex circuits, the M2SES-264-R2 adheres to strict electrical parameters: * **Current Rating:** Generally rated for **0.5A per contact**. While low per pin, the high pin count allows for significant total power delivery if multiple pins are ganged. * **Voltage Rating:** Typically **50V AC/DC**. * **Contact Resistance:** Low ohmic resistance (usually **<50mΩ**) to minimize signal attenuation and heat generation. * **Dielectric Withstanding Voltage:** Designed to withstand **200V - 500V AC** to prevent arcing between closely spaced pins. --- ### 3. Application Areas These parts are designed for environments where space is at a premium but data throughput must remain high: 1. **COM Express Modules:** Used to connect a System-on-Module (SoM) to a carrier board. 2. **FPGA Development Boards:** Providing an interface for high-speed I/O expansion. 3. **Industrial Servers:** Facilitating modular upgrades for CPUs or networking components. 4. **Edge Computing:** Used in ruggedized hardware where vibration resistance and high-density interconnects are required. --- ### 4. Physical Construction The **"R2"** suffix often denotes a specific revision or a specific **Stack Height**. In mezzanine connectors, the stack height (the distance between the two PCBs when mated) is a critical physical dimension for enclosure design. ```text PCB 1 (Module) [M2SES Connector Male] || (Mated Interface) [M2SES Connector Female] PCB 2 (Carrier Board) ``` ---