The **M2SES-2B1-R2** is a specific part number typically associated with **M.2 (NGFF) connector sockets**, commonly manufactured by companies like **LOTES** or **TE Connectivity**. These are surface-mount (SMT) components used on motherboards or interface cards to house M.2 modules (like SSDs, Wi-Fi cards, or WAN modules). Below is a detailed breakdown of its electronic and mechanical specifications. --- ### 1. General Specifications The M2SES series is designed to meet the PCI Express M.2 specification. | Feature | Specification | | :--- | :--- | | **Component Type** | M.2 (NGFF) Connector | | **Mounting Type** | Surface Mount (SMT) | | **Orientation** | Right Angle / Horizontal | | **Pin Count** | 67-Pin / 75-Position | | **Pitch** | 0.50 mm | | **Keying** | Typically **B Key** (check specific datasheet for variations) | --- ### 2. Key Physical Dimensions The "R2" suffix usually denotes a specific height or revision. The height is critical for ensuring the M.2 module clears other components on the PCB. * **Connector Height:** Usually **2.15mm** to **2.25mm** (Common for the -2B1 variant). * **Body Material:** High-temperature thermoplastic (LCP), UL 94V-0 rated. * **Contact Material:** Copper Alloy. * **Plating:** Gold plating on contact areas for high-speed signal integrity and corrosion resistance. --- ### 3. Electrical Characteristics These parts are engineered for high-speed data transmission (PCIe Gen 3/4, SATA 3.0, USB 3.0). | Parameter | Value | | :--- | :--- | | **Voltage Rating** | 50V AC/DC | | **Current Rating** | 0.5A per pin | | **Contact Resistance** | 55mΩ Max | | **Insulation Resistance** | 500MΩ Min | | **Dielectric Strength** | 300V AC for 1 minute | --- ### 4. Keying and Application The "2B1" portion of the code often refers to the **Keying**. In the M.2 standard: * **B Key:** Supports PCIe x2, SATA, USB 2.0/3.0, and audio. Usually used for WWAN (LTE/5G) or SATA SSDs. * **M Key:** Supports PCIe x4. Usually used for NVMe High-Speed SSDs. * **Application:** Primarily used in laptops, industrial PCs, and NUCs for modular expansion. --- ### 5. Soldering & Assembly ```text Reflow Profile: Lead-Free (RoHS Compliant) Peak Temperature: 260°C Packaging: Tape and Reel (TR) for automated SMT pick-and-place ```