Based on the part number **W2XR-9Z1V2-R2**, this component belongs to the **W2XR Series** of high-performance, right-angle board-to-board connectors, typically manufactured by companies like **Winchester Interconnect** or similar high-reliability connector specialists. These parts are designed for high-speed signal integrity in rugged environments. --- ### 1. Component Specifications The "W2XR" series generally refers to high-density, modular connectors used in military, aerospace, and high-end industrial computing (such as VPX or OpenVPX architectures). | Feature | Description | | :--- | :--- | | **Connector Type** | Right-Angle Daughtercard Connector | | **Series** | W2XR (High-speed, Ruggedized) | | **Contact Density** | High-density grid (often 1.8mm or 2.0mm pitch) | | **Signal Integrity** | Optimized for 10+ Gbps data rates | | **Mounting Style** | Press-fit (Compliant Pin) or Solder-tail | | **Orientation** | 90-degree (Right Angle) for perpendicular board mating | --- ### 2. Breakdown of Part Number Logic While specific manufacturer codes vary, the alphanumeric segments generally represent the following: * **W2XR**: The base series (Ruggedized High-Speed X-series). * **9Z**: Often indicates the number of columns or rows (contact configuration). In many high-density headers, this specifies a 9-row or 9-column block. * **1V2**: Refers to the plating thickness (e.g., Gold over Nickel) and the tail length for the PCB interface. * **R2**: Usually denotes the revision level or a specific packaging requirement (like Tape & Reel or Tray). --- ### 3. Key Electronic Characteristics These parts are engineered for demanding electrical environments: * **Differential Pair Geometry:** Designed to minimize crosstalk and maintain 100-ohm impedance for high-speed protocols (PCIe Gen 3/4, Ethernet). * **Mechanical Durability:** Built to withstand high vibration and shock (MIL-STD-810G compliant). * **ESD Protection:** The housing is typically made of high-temperature liquid crystal polymer (LCP) to prevent arcing and withstand reflow temperatures. --- ### 4. Applications This part is commonly found in the following systems: 1. **Embedded Computing:** VPX backplanes and daughtercards. 2. **Radar Systems:** High-frequency signal processing boards. 3. **Network Infrastructure:** Edge routers and high-speed switching fabric. ---