Product Highlights
• Highly integrated, compact footprint
• Up to 240 W peak output power for universal applications without
heat sink
• Integrated 750 V PowiGaN™ with lossless current sensing
• Maintains high power factor up to 305 VAC and can operate
continuously at up to 460 VAC during line swells
• Quasi-resonant DCM control ensures low switching losses, smaller
inductor size than conventional CrM PFC, and permits use of lowcost
boost diode
• Integrated automatic X capacitor discharge and high-voltage
start-up for self bias
• Source-potential cooling pad in InSOP package enables effective
PCB cooling and minimizes EMI
• High efficiency and power factor across load range
• Up to 98.3% efficiency from 10% load to 100% load
• <40 mW no-load consumption at 230 VAC
• PF up to 0.96 achievable at 20% load
• Programmable Power Good (PG) signal for active inrush control
• User selectable power limit enables rapid prototyping: test different
size HiperPFS-5 IC’s in the same design for rapid optimization
• Digital line-peak-detection for robust performance even with
distorted input voltage from UPS or generators
• Digital power factor enhancer compensates for EMI filter and bridge
rectifier distortion
• Enables paralleling of PFC stages to increase output power
• Safety certified to IEC62368
Applications
• PC • High-power adaptors and USB PD
• Printer 3.1 rapid charging
• LCD TV • High-power LED lighting
• Video game consoles • Industrial and appliance
• 80 Plus™ Platinum • Generic PFC converters
Description
The HiperPFS™-5 family of advanced power factor correction ICs
leverages the low switching losses of the 750 V PowiGaN switch to
optimize efficiency. The high integration level and novel control
algorithm minimize system footprint by reducing overall component
count and inductor size. Packaged in the low profile, surface mount
InSOP-T28F, the device dissipates heat directly to the PCB substrate,
eliminating the need for bulky heat sinks. Robust HiperPFS-5 devices
operate from low-line to 305 VAC with over 80% de-rating.