Features
• Multisensing wireless platform for vibration monitoring and ultrasound detection
• Built around STWIN.box core system board with processing, sensing,
connectivity, and expansion capabilities
• Ultra-low power Arm® Cortex®-M33 with FPU and TrustZone at 160 MHz, 2048
kBytes Flash memory (STM32U585AI)
• MicroSD card slot for standalone data logging applications
• On-board Bluetooth® low energy v5.0 wireless technology (BlueNRG-M2), Wi-Fi
(EMW3080) and NFC (ST25DV04K)
• Option to implement authentication and brand protection secure solution with
STSAFE-A110
• Wide range of industrial IoT sensors:
– Ultra-wide bandwidth (up to 6 kHz), low-noise, 3-axis digital vibration
sensor (IIS3DWB)
– 3D accelerometer + 3D gyro iNEMO inertial measurement unit
(ISM330DHCX) with Machine Learning Core
– High-performance ultra-low-power 3-axis accelerometer for industrial
applications (IIS2DLPC)
– Ultra-low power 3-axis magnetometer (IIS2MDC)
– High-accuracy, high-resolution, low-power, 2-axis digital inclinometer with
Embedded Machine Learning Core (IIS2ICLX)
– Dual full-scale, 1.26 bar and 4 bar, absolute digital output barometer in
full-mold package (ILPS22QS)
– Low-voltage, ultra low-power, 0.5°C accuracy I²C/SMBus 3.0 temperature
sensor (STTS22H)
– Industrial grade digital MEMS microphone (IMP34DT05)
– Analog MEMS microphone with frequency response up to 80 kHz
(IMP23ABSU)
• Expandable via a 34-pin FPC connector

Description
The STWIN.box (STEVAL-STWINBX1) is a development kit and reference design
that simplifies prototyping and testing of advanced industrial sensing applications in
IoT contexts such as condition monitoring and predictive maintenance.
It is an evolution of the original STWIN kit (STEVAL-STWINKT1B) and features
a higher mechanical accuracy in the measurement of vibrations, an improved
robustness, an updated BoM to reflect the latest and best-in-class MCU and
industrial sensors, and an easy-to-use interface for external add-ons.
The STWIN.box kit consists of an STWIN.box core system, a 480mAh LiPo battery,
an adapter for the ST-LINK debugger, a plastic case, an adapter board for DIL 24
sensors and a flexible cable.
The many on-board industrial-grade sensors and the ultra-low power MCU enable
applications that feature: ultra-low power, 9 DoF motion sensing, wide-bandwidth
vibration analysis, audio and ultrasound acoustic inspection, very precise local
temperature, and environmental monitoring.