Features
 Surface mount bridge, small package;
 Ideal for printed circuit boards;
 Glass passivated chip junction;
 High forward current capability up to 8.0A;
 High surge current capability;
 High heat dissipation capability;
 Low profile package;
 Low forward voltage drop;
 Plastic package has Underwrites Laboratory
Flammability Classification 94V-0
 This is a Pb − Free Device
 All SMC parts are traceable to the wafer lot
 Additional testing can be offered upon request