1 Features
• Low loss integrated shunt resistor
– Internal resistance: 2 mΩ at TA = 25°C
– Current rating: ±15 A at TA = 25°C
• High-resolution, 16-bit delta-sigma ADC
– Wide common-mode range: –0.3 V to +40 V
– Reports current, bus voltage, power, internal
temperature, energy, and charge
– Programmable conversion time and averaging
• Current monitoring accuracy:
– Total Measurement Error: ±0.5% at 5 A
– Offset current: ±1.5 mA (maximum)
– Gain error: ±0.5% (maximum at 5 A)
– Gain error drift: ±50 ppm/°C (maximum)
• Power monitoring accuracy:
– 0.85% accuracy at 5 A
• Energy and Charge accuracy:
– 1.35% accuracy at 5 A
• Internal monitoring and fault detection
• Precision oscillator: ±0.5% (maximum)
• 2.94-MHz High-Speed I2C interface with 4 pinselectable
addresses
• Operates from a 2.7-V to 5.5-V supply
– Operational current: 640 μA (typical)
– Shutdown current: 5 μA (maximum)

2 Applications
• Notebook computers
• Smartphones
• Industrial battery packs
• Smart network interface cards (NIC)
• Hardware accelerator cards

3 Description
The INA700 is a digital power monitor with an
integrated shunt resistor along with a 16-bit deltasigma
ADC specifically designed for current sensing
applications. The device can measure full-scale
currents up to ±15.728 A, over the common-mode
voltage range of –0.3 V to +40 V.
The INA700 reports current, bus voltage, die
temperature, power, energy and charge accumulation
with a precision ±0.5% integrated oscillator, all
while performing the needed calculations in the
background. The integrated temperature sensor is
±3°C accurate over the junction temperature range.
The low offset and gain error drift of the INA700
allows use in systems that do not undergo
temperature calibration during manufacturing.
The device features selectable ADC conversion
times from 50 μs to 4.12 ms as well as sample
averaging from 1x to 1024x, which further helps
reduce the noise of the measured data and allows for
optimization of overcurrent detection windows.
The device is available in a tiny PowerWCSP
(DSBGA) package to minimize the solution size and
maximize thermal performance.