Low profile space
Ideal for automated placement
Glass passivated chip junction
Low forward voltage drop
Low leakage current
High forward surge capability
High temperature soldering：
260℃/10 seconds at terminals
Component in accordance to
RoHS 2002/95/1 and WEEE 2002/96/EC
FEATURES
Component Index, file number SZXEC1902259902
This series is SGS listed under the Recognized