Features
• Electrical features
- VDSS = 1200 V
- IDN = 390 A
- New semiconductor material - silicon carbide
- Low RDS,on
- Low switching losses
- Low Qg and Crss
- Low inductive design
- Tvj,op = 175°C
- Short-time extended operation temperature Tvj,op = 200 °C
• Mechanical features
- 4.2 kV DC 1 second insulation
- High creepage and clearance distances
- Compact design
- High power density
- Direct-cooled PinFin base plate
- High-performance Si3N4 ceramic
- Guiding elements for PCB and cooler assembly
- Integrated temperature sensing diode
- PressFIT contact technology
- RoHS compliant, lead-free
- UL 94 V0 module frame