CSSOP Datasheet(PDF) - Amkor Technology

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CSSOP Datasheet (PDF) - Amkor Technology

CSSOP Datasheet PDF - Amkor Technology


Part #	CSSOP

Download	CSSOP Download

File Size	304.39 Kbytes

Page	1 Pages

Manufacturer	AMKOR [Amkor Technology]

Direct Link	http://www.amkor.com

Logo

Description

Ceramic Shrink Small Outline Package

CSSOP Datasheet (PDF)

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CSSOP Datasheet PDF - Amkor Technology


Part #	CSSOP

Download	CSSOP Click to download

File Size	304.39 Kbytes

Page	1 Pages

Manufacturer	AMKOR [Amkor Technology]

Direct Link	http://www.amkor.com

Logo

Description	Ceramic Shrink Small Outline Package

CSSOP Datasheet (HTML) - Amkor Technology

CSSOP Datasheet HTML 1Page - Amkor Technology

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Similar Description - CSSOP

Manufacturer	Part #	Datasheet	Description
STMicroelectronics	SSOP24	59Kb / 4P	24-LEAD SHRINK SMALL OUTLINE PACKAGE Nov-2002
National Semiconductor ...	MTD48	62Kb / 1P	48 Lead Molded Thin Shrink Small Outline Package, JEDEC
STMicroelectronics	TSSO20	57Kb / 4P	20-LEAD THIN SHRINK SMALL OUTLINE Nov-2002
fujitsu semiconductor	FPT-20P-M04	37Kb / 1P	THIN SHRINK SMALL OUTLINE PACKAGE
Amkor Technology	CSOIC	374Kb / 1P	Ceramic Small Outline Integrated Circuit Package
STMicroelectronics	TSSOP14	58Kb / 4P	14-LEAD THIN SHRINK SMALL OUTLINE Nov-2002
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Advanced Power Electron...	AP2306AGEN-HF	101Kb / 4P	Small Outline Package
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About Amkor Technology

Amkor Technology is a US-based company that provides outsourced semiconductor packaging and test services. The company was founded in 1968 and is headquartered in Tempe, Arizona, USA.

Amkor's packaging and test services include advanced flip chip and wafer level packaging technologies, as well as through-silicon via (TSV) solutions. These services are used by semiconductor manufacturers to package and test their integrated circuits (ICs) for use in a wide range of applications, including mobile devices, automotive, networking, and computing.

Amkor operates factories and facilities in Asia, Europe, and the Americas, and has a global network of design and development centers. The company has a strong focus on innovation and research and development, and its packaging and test technologies are designed to improve the performance, reliability, and cost-effectiveness of its customers' products.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.

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