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H27U2G8_6F2C Datasheet (PDF) - Hynix Semiconductor

H27U2G8_6F2C Datasheet PDF - Hynix Semiconductor
Part # H27U2G8_6F2C
Download  H27U2G8_6F2C Download
File Size   1001.32 Kbytes
Page   63 Pages
Manufacturer  HYNIX [Hynix Semiconductor]
Direct Link  http://www.skhynix.com/kor/main.do
Logo HYNIX - Hynix Semiconductor
Description 2 Gbit (256M x 8 bit) NAND Flash

H27U2G8_6F2C Datasheet (PDF)

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H27U2G8_6F2C Datasheet PDF - Hynix Semiconductor

Part # H27U2G8_6F2C
Download  H27U2G8_6F2C Click to download

File Size   1001.32 Kbytes
Page   63 Pages
Manufacturer  HYNIX [Hynix Semiconductor]
Direct Link  http://www.skhynix.com/kor/main.do
Logo HYNIX - Hynix Semiconductor
Description 2 Gbit (256M x 8 bit) NAND Flash

H27U2G8_6F2C Datasheet (HTML) - Hynix Semiconductor


H27U2G8_6F2C Product details

FEATURES SUMMARY
DENSITY
- 2Gbit: 2048blocks
Nand FLASH INTERFACE
- NAND Interface
- ADDRESS / DATA Multiplexing
SUPPLY VOLTAGE
- Vcc = 3.0/1.8V Volt core supply voltage for Program,
Erase and Read operations.
MEMORY CELL ARRAY
- X8: (2K + 64) bytes x 64 pages x 2048 blocks
- X16: (1k+32) words x 64 pages x 2048 blocks
PAGE SIZE
- X8: (2048 + 64 spare) bytes
- X16:(1024 + 32spare) Words
Block SIZE
- X8: (128K + 4K spare) bytes
- X16:(64K + 2K spare) Words
PAGE READ / PROGRAM
- Random access: 25us (Max)
- Sequential access: 25ns / 45ns (3.0V/1.8V, min.)
- Program time(3.0V/1.8V): 200us / 250us (Typ)
- Multi-page program time (2 pages):
200us / 250us (3.0V/1.8V, Typ.)
BLOCK ERASE / MULTIPLE BLOCK ERASE
- Block erase time: 3.5 ms (Typ)
- Multi-block erase time (2 blocks):
3.5ms/ 3.5ms (3.0V/1.8V, Typ.)
SEQURITY
- OTP area
- Sreial number (unique ID)
- Non-volatile protection option for OTP and Block0(Opt.)
- Hardware program/erase disabled during
power transition
ADDTIONAL FEATURE
- Multiplane Architecture:
Array is split into two independent planes.
Parallel operations on both planes are available, having
program and erase time.
- Single and multiplane copy back program with automatic
EDC (error detection code)
- Single and multiplane page re-program
- Single and multiplane cache program
- Cache read
- Multiplane block erase
Reliability
- 100,000 Program / Erase cycles (with 1bit /528Byte ECC)
- 10 Year Data retention
ONFI 1.0 COMPLIANT COMMAND SET
ELECTRONICAL SIGNATURE
- Munufacture ID: ADh
- Device ID
PACKAGE
- Lead/Halogen Free
- TSOP48 12 x 20 x 1.2 mm
- FBGA63 9 x 11 x 1.0 mm




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About Hynix Semiconductor


Hynix Semiconductor is a South Korean company that specializes in the design and manufacture of memory semiconductors.
The company was founded in 1983 and is headquartered in Icheon, South Korea.
Hynix is one of the world's leading producers of DRAM (dynamic random access memory) and NAND flash memory, which are used in various applications such as computer systems, mobile devices, and solid-state drives.
Hynix is known for its expertise in memory semiconductor technology and its ability to deliver high-quality and high-performance memory products to its customers.
The company has operations and facilities in various countries across the world and works closely with its customers to provide customized memory solutions that meet their specific requirements and needs.
In addition to its memory products, Hynix also provides a range of products and solutions for the automotive and data center markets, such as system-on-a-chip (SoC) products and high-bandwidth memory (HBM) products.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.




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