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SN74VMEH22501A Datasheet (PDF) - Texas Instruments

SN74VMEH22501A Datasheet PDF - Texas Instruments
Part # SN74VMEH22501A
Download  SN74VMEH22501A Download
File Size   562.07 Kbytes
Page   32 Pages
Manufacturer  TI2 [Texas Instruments]
Direct Link  https://www.ti.com
Logo TI2 - Texas Instruments
Description 8-BIT UNIVERSAL BUS TRANSCEIVER AND TWO 1-BIT BUS TRANSCEIVERS WITH SPLIT LVTTL PORT, FEEDBACK PATH, AND 3-STATE OUTPUTS

SN74VMEH22501A Datasheet (PDF)

Go To PDF Page Download Datasheet
SN74VMEH22501A Datasheet PDF - Texas Instruments

Part # SN74VMEH22501A
Download  SN74VMEH22501A Click to download

File Size   562.07 Kbytes
Page   32 Pages
Manufacturer  TI2 [Texas Instruments]
Direct Link  https://www.ti.com
Logo TI2 - Texas Instruments
Description 8-BIT UNIVERSAL BUS TRANSCEIVER AND TWO 1-BIT BUS TRANSCEIVERS WITH SPLIT LVTTL PORT, FEEDBACK PATH, AND 3-STATE OUTPUTS

SN74VMEH22501A Datasheet (HTML) - Texas Instruments


SN74VMEH22501A Product details

1FEATURES
• Member of the Texas Instruments Widebus™
Family
• UBT™ Transceiver Combines D-Type Latches
and D-Type Flip-Flops for Operation in
Transparent, Latched, or Clocked Modes
• OEC™ Circuitry Improves Signal Integrity and
Reduces Electromagnetic Interference (EMI)
• Compliant With VME64, 2eVME, and 2eSST
Protocols
• Bus Transceiver Split LVTTL Port Provides a
Feedback Path for Control and Diagnostics
Monitoring
• I/O Interfaces Are 5-V Tolerant
• B-Port Outputs (–48 mA/64 mA)
• Y and A-Port Outputs (–12 mA/12 mA)
• Ioff, Power-Up 3-State, and BIAS VCC Support
Live Insertion
• Bus Hold on 3A-Port Data Inputs
• 26-Ω Equivalent Series Resistor on 3A Ports
and Y Outputs
• Flow-Through Architecture Facilitates Printed
Circuit Board Layout
• Distributed VCC and GND Pins Minimize
High-Speed Switching Noise
• Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
• ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)

DESCRIPTION/ORDERING INFORMATION
The SN74VMEH22501A 8-bit universal bus transceiver has two integral 1-bit three-wire bus transceivers and is
designed for 3.3-V VCC operation with 5-V tolerant inputs. The UBT™ transceiver allows transparent, latched, and
flip-flop modes of data transfer, and the separate LVTTL input and outputs on the bus transceivers provide a
feedback path for control and diagnostics monitoring. This device provides a high-speed interface between cards
operating at LVTTL logic levels and VME64, VME64x, or VME320(1) backplane topologies.
The SN74VMEH22501A is pin-for-pin capatible to the SN74VMEH22501 (TI literature number SCES357), but
operates at a wider operating temperature (−40°C to 85°C) range.
High-speed backplane operation is a direct result of the improved OEC™ circuitry and high drive that has been
designed and tested into the VME64x backplane model. The B-port I/Os are optimized for driving large capacitive
loads and include pseudo-ETL input thresholds (½ VCC ± 50 mV) for increased noise immunity. These
specifications support the 2eVME protocols in VME64x (ANSI/VITA 1.1) and 2eSST protocols in VITA 1.5. With
proper design of a 21-slot VME system, a designer can achieve 320-Mbyte transfer rates on linear backplanes
and, possibly, 1-Gbyte transfer rates on the VME320 backplane.
All inputs and outputs are 5-V tolerant and are compatible with TTL and 5-V CMOS inputs.
Active bus-hold circuitry holds unused or undriven 3A-port inputs at a valid logic state. Bus-hold circuitry is not
provided on 1A or 2A inputs, any B-port input, or any control input. Use of pullup or pulldown resistors with the
bus-hold circuitry is not recommended.
This device is fully specified for live-insertion applications using Ioff, power-up 3-state, and BIAS VCC. The Ioff
circuitry prevents damaging current to backflow through the device when it is powered off/on. The power-up
3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents
driver conflict. The BIAS VCC circuitry precharges and preconditions the B-port input/output connections,
preventing disturbance of active data on the backplane during card insertion or removal, and permits true
live-insertion capability.
When VCC is between 0 and 1.5 V, the device is in the high-impedance state during power up or power down.
However, to ensure the high-impedance state above 1.5 V, output-enable (OE and OEBY) inputs should be tied
to VCC through a pullup resistor and output-enable (OEAB) inputs should be tied to GND through a pulldown
resistor; the minimum value of the resistor is determined by the drive capability of the device connected to this
input.




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