1 Features
• Master Subsystem — Arm® Cortex®-M3
– Up to 100 MHz
– Embedded memory
• Up to 512KB of flash (ECC)
• Up to 32KB of RAM (ECC or parity)
• Up to 64KB of shared RAM
• 2KB of IPC Message RAM
– Five Universal Asynchronous Receiver/
Transmitters (UARTs)
– Four Synchronous Serial Interfaces (SSIs) and
a Serial Peripheral Interface (SPI)
– Two Inter-integrated Circuits (I2Cs)
– Universal Serial Bus On-the-Go (USB-OTG) +
PHY
– 10/100 ENET 1588 MII
– Two Controller Area Network, D_CAN, modules
(pin-bootable)
– 32-channel Micro Direct Memory Access
(μDMA)
– Dual security zones (128-bit password per
zone)
– External Peripheral Interface (EPI)
– Micro Cyclic Redundancy Check (μCRC)
module
– Four general-purpose timers
– Two watchdog timer modules
– Three external interrupts
– Endianness: little endian
• Clocking
– On-chip crystal oscillator and external clock
input
– Dynamic Phase-Locked Loop (PLL) ratio
changes supported
• 1.2-V digital, 1.8-V analog, 3.3-V I/O design
• Interprocessor Communications (IPC)
– 32 handshaking channels
– Four channels generate IPC interrupts
– Can be used to coordinate transfer of data
through IPC Message RAMs
• Up to 74 individually programmable, multiplexed
General-Purpose Input/Output (GPIO) pins
– Glitch-free I/Os
• Control Subsystem — TMS320C28x 32-bit CPU
– Up to 150 MHz
– C28x core hardware built-in self-test
– Embedded memory
• Up to 512KB of flash (ECC)
• Up to 36KB of RAM (ECC or parity)
• Up to 64KB of shared RAM
• 2KB of IPC Message RAM
– IEEE-754 single-precision Floating-Point Unit
(FPU)
– Viterbi, Complex Math, CRC Unit (VCU)
– Serial Communications Interface (SCI)
– SPI
– I2C
– 6-channel Direct Memory Access (DMA)
– Nine Enhanced Pulse Width Modulator (ePWM)
modules
• 18 outputs (16 high-resolution)
– Six 32-bit Enhanced Capture (eCAP) modules
– Three 32-bit Enhanced Quadrature Encoder
Pulse (eQEP) modules
– Multichannel Buffered Serial Port (McBSP)
– EPI
– One security zone (128-bit password)
– Three 32-bit timers
– Endianness: little endian
• Analog Subsystem
– Dual 12-bit Analog-to-Digital Converters
(ADCs)
– Up to 2.88 MSPS
– Up to 20 channels
– Four Sample-and-Hold (S/H) circuits
– Up to six comparators with 10-bit Digital-to-
Analog Converter (DAC)
• Package
– 144-Pin RFP PowerPAD™ Thermally Enhanced
Thin Quad Flatpack (HTQFP)
• Temperature options:
– T: –40°C to 105°C Junction
– S: –40°C to 125°C Junction
– Q: –40°C to 125°C Free-Air
(AEC Q100 qualification for automotive
applications)

2 Applications
• Automated sorting equipment
• CNC control
• Central inverter
• String inverter
• AC drive control module
• Servo drive control module
• AC-input BLDC motor drive
• DC-input BLDC motor drive
• Industrial AC-DC
• Three phase UPS