DESCRIPTION
Halide-activated rosin flux conforming to DIN EN 29454-1 1.1.2, EN 61190-1-1 type ROM1.
Stannol 400-25 has been specially formulated for applications in the electronic industry for surfaces which are difficult to
solder. An excellent wetting efficiency when soldering printed circuits, especially in foam fluxers, is achieved by the use of a
stabiliser. The flux has good wetting properties and guarantees complete flux coverage during the soldering process due to
the high rosin contents. The flux residues remaining after the soldering process are dry, plastic and transparent.
Stannol 400-25 has a very wide process window and can be used without any problems.
APPLICATION
Stannol 400-25 can be applied with foam fluxers, but also by dipping, spraying and brushing. The preheating temperature on
the PCB top surface can be set between 80° C and 120° C. During the soldering process a considerable part of the flux is
rinsed off the PCB. If cleaning is required, flux residues can be removed completely with a commercial cleaner. All known
cleaning processes, such as by brushing, ultrasonic, steam etc. are appropriate.
Evaporation of solvent can change the composition. Evaporation causes an increase of the solid content and therefore the
density increases. This can be checked with the Stannol Mini-Titration-Kit.