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315514-002 Datasheet (PDF) - Intel Corporation

315514-002 Datasheet PDF - Intel Corporation
Part # 315514-002
Download  315514-002 Download
File Size   501.7 Kbytes
Page   39 Pages
Manufacturer  INTEL [Intel Corporation]
Direct Link  http://www.intel.com
Logo INTEL - Intel Corporation
Description GbE Controllers

315514-002 Datasheet (PDF)

Go To PDF Page Download Datasheet
315514-002 Datasheet PDF - Intel Corporation

Part # 315514-002
Download  315514-002 Click to download

File Size   501.7 Kbytes
Page   39 Pages
Manufacturer  INTEL [Intel Corporation]
Direct Link  http://www.intel.com
Logo INTEL - Intel Corporation
Description GbE Controllers

315514-002 Datasheet (HTML) - Intel Corporation


315514-002 Product details

Introduction

Unless specifically noted, 82573 refers to the Intel® 82573E, 82573V and 82573L GbE controllers.

82573 GbE controllers are single, compact components with integrated Gigabit Ethernet Media Access Control (MAC) and Physical Layer (PHY) functions. These devices use PCIe* architecture (Revision 1.0a). For desktop, workstation, and value server network designs with critical space constraints, the 82573 enables a GbE implementation in a very small area.

The 82573 provides a standard IEEE 802.3 Ethernet interface for 1000BASE-T, 100BASE-TX, and 10BASE-T applications (802.3, 802.3u, and 802.3ab, respectively). In addition to managing MAC and PHY Ethernet layer functions, the 82573 manages PCIe* packet traffic across its transaction, link, and physical and logical layers.



Product Features

PCIe*

   — x1 PCIe* interface on ICH7 or MCH devices

   — Peak bandwidth: 2 Gb/s per direction

   — Power management

   — High bandwidth density per pin

MAC

   — Optimized transmit and receive queues

   — IEEE 802.3x compliant flow control with software controlled pause times and threshold values

   — Caches up to 64 packet descriptors per queue

   — Programmable host memory receive buffers (256 bytes to 16 KB) and cache line size (16 bytes to 256 bytes)

   — 32 KB configurable transmit and receive FIFO buffer

   — Mechanism available for reducing interrupts generated by transmit and receive operation

   — Descriptor ring management hardware for transmit and receive

   — Optimized descriptor fetching and write-back mechanisms

   — Wide, pipelined internal data path architecture

PHY

   — Integrated PHY for 10/100/1000 Mb/s full and half duplex operation

   — IEEE 802.3ab auto negotiation support

   — IEEE 802.3ab PHY compliance and compatibility

   — DSP architecture implements digital adaptive equalization, echo cancellation, and cross-talk cancellation

Host Offloading

   — Transmit and receive IP, TCP and UDP checksum off-loading capabilities

   — Transmit TCP segmentation, IPv6 offloading, and advanced packet filtering

   — IEEE 802.1q VLAN support with VLAN tag insertion, stripping and packet filtering for up to 4096 VLAN tags

   — Descriptor ring management hardware for transmit and receive Order Number: 315514-002

Manageability

   — Intel® Active Management Technology (Intel® AMT) support (82573E only)

   — Alerting Standards Format 2.0 and advanced pass through support (82573E/V only)

   — Boot ROM Preboot eXecution Environment (PXE) Flash interface support

   — Compliance with PCI Power Management 1.1 and Advanced Configuration and Power Interface (ACPI) 2.0 register set compliant

   — Wake on LAN support

Additional

   — Three activity and link indication outputs that directly drive LEDs

   — Programmable LEDs

   — Internal PLL for clock generation that can use a 25 MHz crystal

   — Power saving feature for the 82573L. During the L1 and L2 link states, the 82573L asserts the Clock Request signal (CLKREQ#) to indicate that its PCIe* reference clock can be gated

   — On-chip power control circuitry

   — Loopback capabilities

   — JTAG (IEEE 1149.1) Test Access Port (TAP) built in silicon

Technology

   — Lead-free 196-pin Thin and Fine Pitch Ball Grid Array (TF-BGA) package

   — Operating temperature: 0° C to 70° C (with external regulators)

   — Operating temperature: 0° to 55° C (with on die 2.5V regulator)

   — Storage temperature -40° C to 125° C



 




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About Intel Corporation


Intel Corporation is an American multinational corporation and technology company headquartered in Santa Clara, California.
It is one of the world's largest and highest valued semiconductor chip makers, based on revenue.
Intel is best known for its development of microprocessors, the central processing units (CPUs) of computers.
Founded in 1968, Intel has been a leader in the computer hardware industry for over five decades.
In addition to microprocessors, the company offers a wide range of products and technologies, including data center and network equipment, solid-state drives, internet of things (IoT) devices, and more.
Intel is also a leading player in the development of 5G networks and autonomous vehicles.
With a focus on innovation and technology leadership, Intel continues to play a significant role in shaping the future of computing and technology.
The company invests heavily in research and development and has been awarded over 17,000 patents for its innovations.

*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.




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