| Manufacturer | Part # | Datasheet | Description |
 NXP Semiconductors |
QN902X
|
693Kb / 44P |
Ultra low power Bluetooth LE system-on-chip solution
Rev. 2.7-21 November 2018 |
 Infineon Technologies A... |
CYBLE-343072-EVAL-M2B
|
3Mb / 4P |
AIROC Bluetooth LE module evaluation kit
Rev. A 08 / 2022 |
|
CYW920820M2EVB-01
|
4Mb / 4P |
AIROC CYW20820 Bluetooth and Bluetooth® LE system on chip evaluation kit
05 / 2022 |
 Toshiba Semiconductor |
TC35667FTG
|
755Kb / 26P |
TC35667FTG Bluetooth® LE Single IC For Bluetooth® Smart
November 2014 Rev 1.x |
 Infineon Technologies A... |
CYW20819
|
508Kb / 52P |
AIROC™ Bluetooth® & Bluetooth® LE system-on-chip Ultra low power, Bluetooth® 5.2
Rev. G 2022-07-13 |
|
CYW20820
|
631Kb / 59P |
AIROC™ Bluetooth® and Bluetooth® LE system on chip
Rev. G 2022-09-26 |
|
CYBLE-343072-02
|
868Kb / 58P |
AIROC™ Bluetooth® LE module
2021-08-12 |
|
CY8C63X6
|
2Mb / 108P |
PSoC™ 63 MCU with Bluetooth® LE
Rev. R 2023-05-10 |
 ESPRESSIF SYSTEMS (SHAN... |
ESP32-WROOM-32E
|
1Mb / 33P |
2.4 GHz WiFi Bluetooth® Bluetooth LE module
2023 |
 Nordic Semiconductor |
NRF51802
|
5Mb / 85P |
Multiprotocol Bluetooth® low energy/2.4 GHz RF System on Chip
v1.2 |