| Manufacturer | Part # | Datasheet | Description |
Texas Instruments |
SN65HVD10DG4
|
559Kb / 28P |
Chassis-to-Chassis Interconnects
|
CTS Corporation |
753
|
189Kb / 4P |
High Density Packaging
|
Ohmite Mfg. Co. |
RES-TA
|
333Kb / 2P |
High Power Density
|
Vicor Corporation |
BCM48BX060Y240A00
|
790Kb / 20P |
High power density
|
|
BCM352X110Y300B00
|
854Kb / 21P |
High power density
|
|
MIL-COTS
|
1Mb / 10P |
High density
|
List of Unclassifed Man... |
FK22PL
|
78Kb / 2P |
High Density Connectors High Density Steckverbinder
|
TE Connectivity Ltd |
1-1773719-1
|
663Kb / 5P |
Inverted Thru Board Interconnects
|
|
5-1773463-0
|
3Mb / 10P |
QSFP28/56 and zQSFP Interconnects
|
Samtec, Inc |
2854182
|
575Kb / 2P |
(2.00 mm) .0787" PITCH • HIGH-RELIABILITY CABLE INTERCONNECTS
|
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