| Manufacturer | Part # | Datasheet | Description |
 International Rectifier |
IRG4CH40SB
|
22Kb / 1P |
IGBT Die in Wafer Form
|
|
HF20A060ACE
|
33Kb / 1P |
Hexfred Die in Wafer Form
|
 InterFET Corporation |
HF51A060ACE
|
18Kb / 1P |
Hexfred Die in Wafer Form
|
 Amkor Technology |
CSPNL
|
157Kb / 2P |
Wafer Level Packaging
|
|
WLCSP
|
474Kb / 2P |
Wafer Level Processing and Die Processing Services
|
 Renesas Technology Corp |
RJP30H2DPK-M0-11
|
159Kb / 6P |
Trench gate and thin wafer technology
|
 Generalplus Technology ... |
GPY0130A
|
770Kb / 26P |
Monolithic and Wafer Level Packaged Three Axis Accelerometer
|
 MEMSIC Semiconductor (T... |
MXC400XXC
|
418Kb / 13P |
Monolithic and Wafer Level Packaged Three-Axis Accelerometer
Rev.B |
|
MXC488XXC
|
508Kb / 13P |
Monolithic and Wafer Level Packaged Three-Axis Accelerometer
Rev.B (3/8/2018) |
 First Silicon Co., Ltd |
FS4A040120K
|
539Kb / 4P |
New Thin Wafer Technology
2022. 06. 09 Revision No : 0 |