| Manufacturer | Part # | Datasheet | Description |
 Hirose Electric |
HP5-189P-1.27W
|
1Mb / 34P |
High-density Packaging System
|
 Tyco Electronics |
1410142-1
|
494Kb / 6P |
High Speed Backplane Interconnect Solutions
|
 List of Unclassifed Man... |
GT26A-B8812
|
697Kb / 2P |
1U QUAD SOCKET PLATFORM FOR HIGH-DENSITY HPC APPLICATION
|
|
S8238
|
698Kb / 2P |
High-density dual-socket server platform for HPC application
|
 Samtec, Inc |
QFSS
|
278Kb / 7P |
QMSS/QFSS High Speed Shielded Terminal 0.635 mm pitch
|
|
QMSS
|
278Kb / 7P |
QMSS/QFSS High Speed Shielded Terminal 0.635 mm pitch
|
|
HDLSP-035-1000
|
396Kb / 1P |
HIGH-DENSITY/HIGH-SPEED CABLE SYSTEM
|
|
LSS-110-02-F-DV-A
|
265Kb / 1P |
High-speed/High-density HIGH-SPEED HERMAPHRODITIC STRIP
|
 Advantech Co., Ltd. |
SOM-D580
|
4Mb / 6P |
Intel® Xeon® D-2700 Processor (Ice Lake-D HCC) COM-HPC® Server Size D
17-Aug-2022 |
|
SOM-DH7000
|
483Kb / 2P |
Development Board for COM-HPC® Server Proprietary Pinout Modules
21-Jun-2022 |