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0015800523 Datasheet (PDF) - Molex Electronics Ltd.

Part #	0015800523

Description	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 52 Circuits, 0.38關m (15關) Gold (Au) Selective Plating

File Size	1229.87 Kbytes

Html View	1 2 3 4 5 6 7

Manufacturer	MOLEX2 [Molex Electronics Ltd.]

Direct Link	http://www.molex.com

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0015800523 Datasheet (PDF) - Molex Electronics Ltd.

Similar Part No. - 0015800523

Manufacturer	Part #	Datasheet	Description
Molex Electronics Ltd.	0015800521	1Mb / 7P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 52 Circuits, Tin (Sn) Plating
Molex Electronics Ltd.	0015800525	1Mb / 7P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 52 Circuits

Similar Description - 0015800523

Manufacturer	Part #	Datasheet	Description
Molex Electronics Ltd.	0015800369	1Mb / 7P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 36 Circuits, 0.38關m (15關) Gold, (Au) Selective Plating
	0015800089	1Mb / 7P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, 0.38關m (15關) Gold, (Au) Selective Plating
	0015800269	1Mb / 7P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 26 Circuits, 0.38關m (15關) Gold, (Au) Selective Plating
	0015800069	1Mb / 7P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.38關m (15關) Gold, (Au) Selective Plating
	0015800063	1Mb / 7P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.38關m (15關) Gold (Au) Selective Plating
	0015800483	1Mb / 7P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 48 Circuits, 0.38關m (15關) Gold (Au) Selective Plating
	0015800283	1Mb / 7P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, 0.38關m (15關) Gold (Au) Selective Plating
	0015800263	1Mb / 7P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 26 Circuits, 0.38關m (15關) Gold (Au) Selective Plating
	0015800209	1Mb / 7P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.38關m (15關) Gold, (Au) Selective Plating
	0015477652	388Kb / 4P	2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, High Temperature, Shrouded, with Peg, 52 Circuits, 0.38關m (15關) Gold (Au) Selective Plating

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