| Manufacturer | Part # | Datasheet | Description |
Molex Electronics Ltd. |
0877585016
|
182Kb / 4P |
2.00mm (.079) Pitch Milli-Grid??Header, Through Hole, Vertical, 50 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
|
|
0791077024
|
278Kb / 5P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row, 3.00mm (.118) Tail Length, 0.38關m (15關) Gold (Au) Selective Plating, 50 Circuits
|
|
0791077005
|
278Kb / 5P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row, 3.00mm (.118) Tail Length, 0.38關m (15關) Gold (Au) Selective Plating
|
|
0791077224
|
278Kb / 5P |
2.00mm (.079) Pitch Milli-Grid??Receptacle, Vertical, Through Hole, Dual Row, 1.91mm (.075) Tail Length, 0.38關m (15關) Gold (Au) Selective Plating, 50 Circuits
|
|
0877615001
|
308Kb / 5P |
2.00mm (.079) Pitch Milli-Grid??Header, Dual Row Dual Body, Through Hole, Vertical, 50 Circuits, 0.75關m (30關) Gold (Au) Selective Plating, 10.30mm (.406) Stacking Height
|
|
0877612400
|
308Kb / 5P |
2.00mm (.079) Pitch Milli-Grid??Header, Dual Row Dual Body, Through Hole, Vertical, 24 Circuits, 0.75關m (30關) Gold (Au) Selective Plating
|
|
0877612001
|
308Kb / 5P |
2.00mm (.079) Pitch Milli-Grid??Header, Dual Row Dual Body, Through Hole, Vertical, 20 Circuits, 0.75關m (30關) Gold (Au) Selective Plating
|
|
0878315220
|
236Kb / 4P |
2.00mm (.079) Pitch Milli-Grid??Header, Vertical, Through Hole, Shrouded, 20 Circuits, 0.38關m (15關) Gold (Au) Plating
|
|
0877615021
|
309Kb / 5P |
2.00mm (.079) Pitch Milli-Grid??Header, Dual Row Dual Body, Through Hole, Vertical, 50 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, 8.70mm (.343) Stacking Height
|
|
0877614408
|
106Kb / 3P |
2.00mm (.079) Pitch Milli-Grid??Header, Dual Row Dual Body, Through Hole, Vertical, 44 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, 12.50mm (.492) Stacking
|
New Zealand ▼ 
English
Chinese
German
Japanese
Russian
Korean
Spanish
French
Italian
Portuguese
Polish
Vietnamese
Indian
Mexican
British
New Zealand
