| Manufacturer | Part # | Datasheet | Description |
 Molex Electronics Ltd. |
0877583417
|
182Kb / 4P |
2.00mm (.079) Pitch Milli-Grid??Header, Through Hole, Vertical, 34 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
|
|
0879144405
|
4Mb / 57P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 44 Circuits, 0.76關m (30關) Gold (Au) Plating, Tray Packaging, Lead-free
|
|
0879114212
|
375Kb / 6P |
2.54mm (.100) Pitch C-Grid짰 Header, Right Angle, Through Hole, 42 Circuits, 0.76關m (30關) Gold (Au) Selective Plating, Tube Packaging, Lead-free
|
|
0879143205
|
4Mb / 57P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 32 Circuits, 0.76關m (30關) Gold (Au) Plating, Tray Packaging, Lead-free
|
|
0879144204
|
4Mb / 57P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 42 Circuits, 0.38關m (15關) Gold (Au) Plating, Tray Packaging, Lead-free
|
|
0879144201
|
770Kb / 11P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 42 Circuits, 0.38關m (15關) Gold (Au) Plating, Tray Packaging, Lead-free
|
|
0879142815
|
3Mb / 48P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75關m (30關) Gold (Au) Plating, Tray Packaging, Lead-free
|
|
0879113411
|
372Kb / 6P |
2.54mm (.100) Pitch C-Grid짰 Header, Right Angle, Through Hole, 34 Circuits, 0.38關m (15關) Gold (Au) Selective Plating, Tube Packaging, Lead-free
|
|
0879141001
|
770Kb / 11P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 10 Circuits, 0.38關m (15關) Gold (Au) Plating, Tray Packaging, Lead-free
|
|
0879140001
|
3Mb / 48P |
2.54mm (.100) Pitch C-Grid짰 Header, Through Hole, Dual Row, Vertical, 10 Circuits, 0.38關m (15關) Gold (Au) Plating, Tray Packaging, Lead-free
|